Inventor · disambiguated record
Shyam Sundar Venkataraman
Also filed as: VENKATARAMAN SHYAM · VENKATARAMAN SHYAM S · VENKATARAMAN SHYAM SUNDAR
9 granted patents·6 pending applications·14 citations·filing 2009–2024
80Inventor score
Top patents by PatentIndex Score
15 records- 0176US9524874B2Aqueous polishing composition and process for chemically mechanically polishing substrates containing silicon oxide dielectric and polysilicon filmsVENKATARAMAN SHYAM SUNDAR·Filed 2011·Granted Dec 20, 2016·6 cites·17 claims
- 0271US9487675B2Chemical mechanical polishing composition comprising polyvinyl phosphonic acid and its derivativesRAMAN VIJAY IMMANUEL·Filed 2011·Granted Nov 8, 2016·3 cites·11 claims
- 0369US9458415B2Post chemical-mechanical-polishing (post-CMP) cleaning composition comprising a specific sulfur-containing compound and a sugar alcohol or a polycarboxylic acidBASF SE·Filed 2013·Granted Oct 4, 2016·2 cites·32 claims
- 0462US8597539B2Chemical mechanical polishing (CMP) polishing solution with enhanced performanceLI YUZHUO·Filed 2009·Granted Dec 3, 2013·2 cites·20 claims
- 0557US2025133139A1Demand serverless container based storage transferGOOGLE LLC·Filed 2024·Application pending·0 cites
- 0656US12238170B2On demand serverless container based storage transferGOOGLE LLC·Filed 2023·Granted Feb 25, 2025·0 cites·16 claims
- 0755US9255214B2Chemical mechanical polishing (CMP) composition comprising inorganic particles and polymer particlesLAUTER MICHAEL·Filed 2010·Granted Feb 9, 2016·1 cites·19 claims
- 0849US11110433B2Metal-doped tin oxide for electrocatalysis applicationsBASF SE·Filed 2017·Granted Sep 7, 2021·0 cites·18 claims
- 0936US9275851B2Aqueous, nitrogen-free cleaning composition and its use for removing residues and contaminants from semiconductor substrates suitable for manufacturing microelectronic devicesKLIPP ANDREAS·Filed 2012·Granted Mar 1, 2016·0 cites·14 claims
- 1036US9157012B2Process for the manufacture of semiconductor devices comprising the chemical mechanical polishing of borophosphosilicate glass (BPSG) material in the presence of a CMP composition comprising anionic phosphate or phosphonateVENKATARAMAN SHYAM SUNDAR·Filed 2011·Granted Oct 13, 2015·0 cites·17 claims
- 1133US2013171824A1Process for chemically mechanically polishing substrates containing silicon oxide dielectric films and polysilicon and/or silicon nitride filmsLI YUZHUO·Filed 2011·Application pending·0 cites
- 1233US2013161285A1Aqueous polishing composition and process for chemically mechanically polishing substrate materials for electrical, mechanical and optical devicesLI YUZHUO·Filed 2011·Application pending·0 cites
- 1333US2013168348A1Aqueous polishing composition and process for chemically mechanically polishing substrates containing silicon oxide dielectric and polysilicon filmsLI YUZHUO·Filed 2011·Application pending·0 cites
- 1433US2013200038A1Aqueous polishing composition and process for chemically mechanically polishing substrates for electrical, mechanical and optical devicesLI YUZHUO·Filed 2011·Application pending·0 cites
- 1531US2013200039A1Aqueous polishing compositions containing n-substituted diazenium dioxides and/or n'-hydroxy-diazenium oxide saltsNOLLER BASTIAN·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →