Inventor · disambiguated record
Jung-Chih Hu
Also filed as: HU JUNG-CHIH
8 granted patents·3 pending applications·78 citations·filing 1998–2013
87Inventor score
Files withTAIWAN SEMICONDUCTOR MFG3UNITED MICROELECTRONICS CORP3WU WENG-JIN2CHIOU WEN-CHIH1MERCK PATENT GMBH1
Top patents by PatentIndex Score
11 records- 0191US8691664B2Backside process for a substrateYANG KU-FENG·Filed 2010·Granted Apr 8, 2014·14 cites·20 claims
- 0283US8486823B2Methods of forming through viaCHIOU WEN-CHIH·Filed 2008·Granted Jul 16, 2013·10 cites·9 claims
- 0379US8058150B2Particle free wafer separationWU WENG-JIN·Filed 2008·Granted Nov 15, 2011·6 cites·20 claims
- 0472US6858123B1Galvanizing solution for the galvanic deposition of copperMERCK PATENT GMBH·Filed 2000·Granted Feb 22, 2005·10 cites·8 claims
- 0569US7943421B2Component stacking using pre-formed adhesive filmsTAIWAN SEMICONDUCTOR MFG·Filed 2008·Granted May 17, 2011·3 cites·20 claims
- 0668US8664749B2Component stacking using pre-formed adhesive filmsWU WENG-JIN·Filed 2011·Granted Mar 4, 2014·2 cites·20 claims
- 0760US6417118B1Method for improving the moisture absorption of porous low dielectric filmUNITED MICROELECTRONICS CORP·Filed 2001·Granted Jul 9, 2002·16 cites·20 claims
- 0852US6171717B1Structure of stacked barrier layerUNITED MICROELECTRONICS CORP·Filed 1998·Granted Jan 9, 2001·17 cites·23 claims
- 0950US2013277844A1Through via processTAIWAN SEMICONDUCTOR MFG·Filed 2013·Application pending·0 cites
- 1048US2010062693A1Two step method and apparatus for polishing metal and other films in semiconductor manufacturingTAIWAN SEMICONDUCTOR MFG·Filed 2008·Application pending·0 cites
- 1136US2003148630A1Self-grown hydrophobic nano molecule organic diffusion barrier and method of the sameUNITED MICROELECTRONICS CORP·Filed 2003·Application pending·0 cites
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