Inventor · disambiguated record
Toyoaki Matsuzaki
Also filed as: MATSUZAKI TOYOAKI
8 granted patents·9 pending applications·25 citations·filing 2001–2007
82Inventor score
Top patents by PatentIndex Score
17 records- 0172US7228893B2Heat exchange unitXENESYS INC·Filed 2005·Granted Jun 12, 2007·4 cites·11 claims
- 0260US7069982B2Heat transfer member and method for manufacturing sameXENESYS INC·Filed 2004·Granted Jul 4, 2006·5 cites·3 claims
- 0355US7121330B2Heat exchange unitXENESYS INC·Filed 2002·Granted Oct 17, 2006·5 cites·6 claims
- 0453US2007245560A1Method for manufacturing a heat exchangerXENESYS INC·Filed 2007·Application pending·0 cites
- 0552US6675618B2Method for manufacturing heat transfer memberXENESYS INC·Filed 2002·Granted Jan 13, 2004·4 cites·16 claims
- 0652US2007251925A1Method for manufacturing a heat exchangerXENESYS INC·Filed 2007·Application pending·0 cites
- 0752US2007000654A1Heat exchange unitXENESYS INC·Filed 2006·Application pending·0 cites
- 0851US2006254758A1Heat exchange unitXENESYS INC·Filed 2006·Application pending·0 cites
- 0951US2006185835A1Heat exchange plateMATSUZAKI TOYOAKI·Filed 2006·Application pending·0 cites
- 1051US2007151717A1Heat exchange plateXENESYS INC·Filed 2006·Application pending·0 cites
- 1150US2005150645A1Plate for heat exchange and heat exchange unitXENESYS INC·Filed 2005·Application pending·0 cites
- 1250US2006162915A1Heat exchange plateMATSUZAKI TOYOAKI·Filed 2006·Application pending·0 cites
- 1348US6793014B2Heat transfer member and method for manufacturing sameXENESYS INC·Filed 2002·Granted Sep 21, 2004·3 cites·9 claims
- 1448US6651332B2Method for manufacturing heat transfer memberXENESYS INC·Filed 2001·Granted Nov 25, 2003·4 cites·20 claims
- 1537US7022933B2Seam welding apparatusDENGENSHA MFG CO LTD·Filed 2003·Granted Apr 4, 2006·0 cites·5 claims
- 1637US2003024697A1Heat transfer member and method for manufacturing sameFiled 2002·Application pending·0 cites
- 1736US6840080B2Press-forming apparatusXENESYS INC·Filed 2003·Granted Jan 11, 2005·0 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →