Inventor · disambiguated record
Yuji Imoto
Also filed as: IMOTO YUJI
26 granted patents·8 pending applications·78 citations·filing 2013–2025
94Inventor score
Top patents by PatentIndex Score
34 records- 0192US10388589B2Semiconductor device, inverter device, and vehicleMITSUBISHI ELECTRIC CORP·Filed 2015·Granted Aug 20, 2019·11 cites·15 claims
- 0290US9888617B2Semiconductor device having multiple power modules and cooling mechanism for the power modulesMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Feb 6, 2018·9 cites·7 claims
- 0386US10104775B2Semiconductor device and method for manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2014·Granted Oct 16, 2018·9 cites·13 claims
- 0486US9064846B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2014·Granted Jun 23, 2015·9 cites·8 claims
- 0580US10978366B2Power module having a hole in a lead frame for improved adhesion with a sealing resin, electric power conversion device, and method for producing power moduleMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Apr 13, 2021·3 cites·19 claims
- 0679US10658324B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2018·Granted May 19, 2020·2 cites·5 claims
- 0778US10211122B2Semiconductor module including a case and base boardMITSUBISHI ELECTRIC CORP·Filed 2014·Granted Feb 19, 2019·4 cites·11 claims
- 0878US2025331114A1Cover member and method for manufacturing cover memberAGC INC·Filed 2025·Application pending·0 cites
- 0977US9917064B2Semiconductor device with a plate-shaped lead terminalMITSUBISHI ELECTRIC CORP·Filed 2015·Granted Mar 13, 2018·3 cites·16 claims
- 1077USD715747SCooling jacketMITSUBISHI ELECTRIC CORP·Filed 2013·Granted Oct 21, 2014·21 cites·1 claims
- 1169US9455215B2Semiconductor device and method for manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2014·Granted Sep 27, 2016·2 cites·11 claims
- 1267US11101225B2Semiconductor device and power conversion deviceMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Aug 24, 2021·1 cites·15 claims
- 1367US10727163B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Jul 28, 2020·1 cites·13 claims
- 1466US11239123B2Semiconductor module, semiconductor device, and vehicleMITSUBISHI ELECTRIC CORP·Filed 2013·Granted Feb 1, 2022·2 cites·15 claims
- 1563US12195386B2Chemically strengthened glass and manufacturing method of chemically strengthened glassAGC INC·Filed 2022·Granted Jan 14, 2025·0 cites·15 claims
- 1661US9698091B2Power semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2015·Granted Jul 4, 2017·1 cites·8 claims
- 1761US2023122091A1Glass structure and cover glassAGC INC·Filed 2022·Application pending·0 cites
- 1860US2024345432A1Glass, glass structure, and on-vehicle display deviceAGC INC·Filed 2024·Application pending·0 cites
- 1955US2025149399A1Power module and power conversion apparatusMITSUBISHI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 2051US11996355B2Semiconductor device and method for manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2019·Granted May 28, 2024·0 cites·13 claims
- 2148US11257768B2Semiconductor device and power conversion deviceMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Feb 22, 2022·0 cites·11 claims
- 2247US11145616B2Semiconductor device, power conversion apparatus, and method for manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Oct 12, 2021·0 cites·9 claims
- 2347US2025329659A1Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 2447US2025157981A1Semiconductor device and method of manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 2546US10707141B2Semiconductor device and manufacturing method thereofMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Jul 7, 2020·0 cites·7 claims
- 2646US2017103960A1Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2016·Application pending·0 cites
- 2745US12131969B2Semiconductor moduleMITSUBISHI ELECTRIC CORP·Filed 2019·Granted Oct 29, 2024·0 cites·18 claims
- 2844US11450592B2Semiconductor package with a plurality of chips having a groove in the encapsulationMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Sep 20, 2022·0 cites·20 claims
- 2944US2025219007A1Semiconductor device and method of manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 3043US10770376B2Semiconductor device, inverter unit and automobileMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Sep 8, 2020·0 cites·16 claims
- 3143US9691730B2Semiconductor device and method for manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2015·Granted Jun 27, 2017·0 cites·4 claims
- 3240US10068819B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Sep 4, 2018·0 cites·9 claims
- 3338US10504820B2Semiconductor module and electric power conversion deviceMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Dec 10, 2019·0 cites·10 claims
- 3438US10204886B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Feb 12, 2019·0 cites·16 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →