Inventor · disambiguated record
Dong June Kim
Also filed as: KIM DONG JUNE
10 granted patents·3 pending applications·18 citations·filing 2001–2023
83Inventor score
Top patents by PatentIndex Score
13 records- 0163US11242827B2Dual purge device for vehicleHYUNDAI KEFICO CORP·Filed 2020·Granted Feb 8, 2022·0 cites·10 claims
- 0256US11506151B2Dual purge ejector and dual purge system using the sameHYUNDAI KEFICO CORP·Filed 2021·Granted Nov 22, 2022·0 cites·9 claims
- 0356US2025131608A1Method for generating adaptive conversation images through emotion regulation and device for performing the same methodKIM DONG JUNE·Filed 2023·Application pending·0 cites
- 0449US6609741B2Parts suction head having non-contact sealing structureMIRAE CORP·Filed 2001·Granted Aug 26, 2003·4 cites·19 claims
- 0547US6497440B2Gripper for parts having different shape in surface mount deviceMIRAE CORP·Filed 2001·Granted Dec 24, 2002·3 cites·18 claims
- 0646US6834999B2Fan apparatus for chamber of handlerMIRAE CORP·Filed 2002·Granted Dec 28, 2004·2 cites·23 claims
- 0746US6577117B2Rotation sensing device of fan apparatus adapted to chamber of handlerMIRAE CORP·Filed 2002·Granted Jun 10, 2003·2 cites·5 claims
- 0844US11242826B2Intake manifold and runner structure thereofHYUNDAI KEFICO CORP·Filed 2020·Granted Feb 8, 2022·0 cites·15 claims
- 0942US11348454B2Device and method for calculating air pollutant emissions from road mobile sourceSEOUL INSTITUTE OF TECH·Filed 2020·Granted May 31, 2022·0 cites·7 claims
- 1040USD1009471SCover for earphone caseGreedy Farmers·Filed 2019·Granted Jan 2, 2024·4 cites·1 claims
- 1136US6779253B2Grip tip of gripper for parts having different shape in surface mount deviceMIRAE CORP·Filed 2001·Granted Aug 24, 2004·3 cites·21 claims
- 1235US2002185875A1Parts suction head of surface mount deviceMIRAE CORP·Filed 2001·Application pending·0 cites
- 1335US2002050537A1Nozzle apparatus of surface mounting deviceMIRAE CORP·Filed 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →