Inventor · disambiguated record
Chongyang Wang
Also filed as: WANG CHONGYANG · WANG CHONGYANG C · WANG CHONGYANG CHRIS
31 granted patents·15 pending applications·589 citations·filing 1996–2025
97Inventor score
Files withAPPLIED MATERIALS INC18HUAWEI TECH CO LTD9ISHIKAWA TETSUYA5SOKUDO CO LTD2APPLIED MATERIALS ISRAEL LTD1
Top patents by PatentIndex Score
46 records- 0198US7925377B2Cluster tool architecture for processing a substrateAPPLIED MATERIALS INC·Filed 2006·Granted Apr 12, 2011·45 cites·3 claims
- 0298US7743728B2Cluster tool architecture for processing a substrateAPPLIED MATERIALS INC·Filed 2008·Granted Jun 29, 2010·36 cites·16 claims
- 0398US7694647B2Cluster tool architecture for processing a substrateAPPLIED MATERIALS INC·Filed 2006·Granted Apr 13, 2010·42 cites·19 claims
- 0498US7357842B2Cluster tool architecture for processing a substrateSOKUDO CO LTD·Filed 2005·Granted Apr 15, 2008·106 cites·11 claims
- 0596US8146530B2Cluster tool architecture for processing a substrateISHIKAWA TETSUYA·Filed 2008·Granted Apr 3, 2012·22 cites·8 claims
- 0695US8550031B2Cluster tool architecture for processing a substrateISHIKAWA TETSUYA·Filed 2012·Granted Oct 8, 2013·13 cites·10 claims
- 0794US8215262B2Cluster tool architecture for processing a substrateISHIKAWA TETSUYA·Filed 2008·Granted Jul 10, 2012·15 cites·9 claims
- 0894US8181596B2Cluster tool architecture for processing a substrateISHIKAWA TETSUYA·Filed 2008·Granted May 22, 2012·15 cites·20 claims
- 0992US5975740AApparatus, method and medium for enhancing the throughput of a wafer processing facility using a multi-slot cool down chamber and a priority transfer schemeAPPLIED MATERIALS INC·Filed 1996·Granted Nov 2, 1999·95 cites·21 claims
- 1090USD892515SLaptop deskWANG CHONGYANG·Filed 2020·Granted Aug 11, 2020·21 cites·1 claims
- 1190US7522968B2Scheduling method for processing equipmentAPPLIED MATERIALS INC·Filed 2007·Granted Apr 21, 2009·18 cites·17 claims
- 1290US6360132B2Apparatus, method and medium for enhancing the throughput of a wafer processing facility using a multi-slot cool down chamber and a priority transfer schemeAPPLIED MATERIALS INC·Filed 2001·Granted Mar 19, 2002·34 cites·9 claims
- 1389US11954061B2Mapping method and mapping device for reconfigurable arrayBEIJING TSINGMICRO INTELLIGENT TECH CO LTD·Filed 2021·Granted Apr 9, 2024·2 cites·8 claims
- 1488US8019467B2Scheduling method for processing equipmentAPPLIED MATERIALS INC·Filed 2007·Granted Sep 13, 2011·15 cites·18 claims
- 1587US6580955B2Apparatus, method and medium for enhancing the throughput of a wafer processing facility using a multi-slot cool down chamber and a priority transfer schemeAPPLIED MATERIALS INC·Filed 2002·Granted Jun 17, 2003·26 cites·30 claims
- 1686US6201998B1Apparatus, method and medium for enhancing the throughput of a wafer processing facility using a multi-slot cool down chamber and a priority transfer schemeAPPLIED MATERIALS INC·Filed 1999·Granted Mar 13, 2001·55 cites·10 claims
- 1776US6449520B1Apparatus, method and medium for enhancing the throughput of a wafer processing facility using a multi-slot cool down chamber and a priority transfer schemeAPPLIED MATERIALS INC·Filed 2001·Granted Sep 10, 2002·13 cites·23 claims
- 1874US10740271B2Connecting apparatus and systemHUAWEI TECH CO LTD·Filed 2015·Granted Aug 11, 2020·2 cites·20 claims
- 1974US2024152127A1Methods and systems for cleaning process sequence managementAPPLIED MATERIALS ISRAEL LTD·Filed 2024·Application pending·0 cites
- 2073US12009237B2Sequencer time leaping executionAPPLIED MATERIALS INC·Filed 2022·Granted Jun 11, 2024·0 cites·15 claims
- 2171US8527080B2Method and system for managing process jobs in a semiconductor fabrication facilityASSAF SHAY·Filed 2008·Granted Sep 3, 2013·10 cites·20 claims
- 2270US12282315B2Scheduling substrate routing and processingAPPLIED MATERIALS INC·Filed 2022·Granted Apr 22, 2025·0 cites·20 claims
- 2369US11874649B2Methods and systems for cleaning process sequence managementAPPLIED MATERIALS INC·Filed 2021·Granted Jan 16, 2024·0 cites·20 claims
- 2468US9843510B2Method and network device for selecting label switched pathHUAWEI TECH CO LTD·Filed 2012·Granted Dec 12, 2017·2 cites·11 claims
- 2566US2025028304A1Queue time controlAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 2666US2025055351A1Motor and electrical productNIDEC CORP·Filed 2024·Application pending·0 cites
- 2765US2025309552A1Base station antenna and base stationHUAWEI TECH CO LTD·Filed 2025·Application pending·0 cites
- 2864US11385628B2Scheduling substrate routing and processingAPPLIED MATERIALS INC·Filed 2020·Granted Jul 12, 2022·0 cites·17 claims
- 2962US11437254B2Sequencer time leaping executionAPPLIED MATERIALS INC·Filed 2020·Granted Sep 6, 2022·0 cites·17 claims
- 3060US2012180983A1Cluster tool architecture for processing a substrateISHIKAWA TETSUYA·Filed 2012·Application pending·0 cites
- 3160US2008223293A1Cluster tool architecture for processing a substrateSOKUDO CO LTD·Filed 2008·Application pending·0 cites
- 3259US11698877B2Connecting apparatus and systemHUAWEI TECH CO LTD·Filed 2020·Granted Jul 11, 2023·0 cites·24 claims
- 3358US2024036202A1Lidars and ranging methodsHESAI TECHNOLOGY CO LTD·Filed 2023·Application pending·0 cites
- 3454US12254321B2Method of resetting integrated circuit with synchronous reset signal, and integrated circuitSANECHIPS TECH CO LTD·Filed 2021·Granted Mar 18, 2025·0 cites·20 claims
- 3552US2023411881A1Connector, frame device, and connector assembly methodHUAWEI TECH CO LTD·Filed 2023·Application pending·0 cites
- 3651US2023344126A1Electronic component and antennaHUAWEI TECH CO LTD·Filed 2023·Application pending·0 cites
- 3748US2023091656A1Scanning device, driving condition setting method, and scanning display moduleCHENGDU IDEALSEE TECHNOLOGY CO LTD·Filed 2022·Application pending·0 cites
- 3846US7447428B2Method and device for data-flow protection of optical interface in data communication equipmentHUAWEI TECH CO LTD·Filed 2003·Granted Nov 4, 2008·2 cites·7 claims
- 3945US7580633B2Method and device for data-flow protection of optical interface in data communication equipmentHUAWEI TECH CO LTD·Filed 2008·Granted Aug 25, 2009·0 cites·11 claims
- 4042US2008216077A1Software sequencer for integrated substrate processing systemAPPLIED MATERIALS INC·Filed 2007·Application pending·0 cites
- 4139US2003237013A1Method and apparatus for providing clocks for network equipmentFiled 2003·Application pending·0 cites
- 4239US2008051930A1Scheduling method for processing equipmentOH HILARIO L·Filed 2007·Application pending·0 cites
- 4337US2012257618A1Method for Expanding a Single Chassis Network or Computing Platform Using Soft InterconnectsPAN YUANCHENG CHRISTOPHER·Filed 2012·Application pending·0 cites
- 4436US11717151B2Method for early diagnosis of keratoconus based on multi-modal dataSHANGHAI MEDIWORKS PREC INSTRUMENTS CO LTD·Filed 2021·Granted Aug 8, 2023·0 cites·5 claims
- 4536US10129183B2Connection apparatus and connection apparatus management methodHUAWEI TECH CO LTD·Filed 2015·Granted Nov 13, 2018·0 cites·20 claims
- 4635US2007003842A1Software sequencer to dynamically adjust wafer transfer decisionAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →