Inventor · disambiguated record
Takashi Hayasaka
Also filed as: HAYASAKA TAKASHI
22 granted patents·3 pending applications·218 citations·filing 1994–2024
95Inventor score
Top patents by PatentIndex Score
25 records- 0195US11404181B2Copper alloy wire, plated wire, electrical wire and cableHITACHI METALS LTD·Filed 2021·Granted Aug 2, 2022·2 cites·8 claims
- 0290US10920306B2Aluminum alloy wire rod and producing method thereofHITACHI METALS LTD·Filed 2018·Granted Feb 16, 2021·2 cites·25 claims
- 0389US11355258B2Aluminum alloy wire rod and producing method thereforHITACHI METALS LTD·Filed 2019·Granted Jun 7, 2022·2 cites·16 claims
- 0483US5491655ASemiconductor memory device having non-selecting level generation circuitry for providing a low potential during reading mode and high level potential during another operation modeMITSUBISHI ELECTRIC CORP·Filed 1995·Granted Feb 13, 1996·38 cites·4 claims
- 0580US7426663B2Semiconductor integrated circuit and testing method thereofRENESAS TECH CORP·Filed 2007·Granted Sep 16, 2008·11 cites·5 claims
- 0680US5659513AStatic semiconductor memory device having improved characteristicsMITSUBISHI ELECTRIC CORP·Filed 1995·Granted Aug 19, 1997·31 cites·3 claims
- 0780US5544105AStatic semiconductor memory device having circuitry for lowering potential of bit lines at commencement of data writingMITSUBISHI ELECTRIC CORP·Filed 1994·Granted Aug 6, 1996·29 cites·7 claims
- 0879US9787627B2Viewer interface for broadcast image contentNISHIZAWA MANABU·Filed 2012·Granted Oct 10, 2017·4 cites·15 claims
- 0975US5506805AStatic semiconductor memory device having circuitry for enlarging write recovery marginMITSUBISHI ELECTRIC CORP·Filed 1995·Granted Apr 9, 1996·25 cites·5 claims
- 1073US7222272B2Semiconductor integrated circuit and testing method thereofHITACHI ULSI SYS CO LTD·Filed 2003·Granted May 22, 2007·18 cites·7 claims
- 1172US12427777B2Liquid storage containerCANON KK·Filed 2024·Granted Sep 30, 2025·0 cites·20 claims
- 1271US5629900ASemiconductor memory device operable to write data accurately at high speedMITSUBISHI ELECTRIC CORP·Filed 1995·Granted May 13, 1997·20 cites·7 claims
- 1368US12205730B2Conductive wire, method for manufacturing conductive wire, casting conductive wire, cable and method for manufacturing cableHITACHI METALS LTD·Filed 2020·Granted Jan 21, 2025·0 cites·9 claims
- 1465US5515326AStatic semiconductor memory device having circuitry for lowering potential of bit lines at commencement of data writingMITSUBISHI ELECTRIC CORP·Filed 1995·Granted May 7, 1996·16 cites·3 claims
- 1561US10720258B2Method for manufacturing a conductive wireHITACHI METALS LTD·Filed 2017·Granted Jul 21, 2020·0 cites·8 claims
- 1659US12415356B2Liquid ejection head and method for manufacturing the sameCANON KK·Filed 2023·Granted Sep 16, 2025·0 cites·16 claims
- 1759US2025065638A1Cartridge and liquid ejection apparatusCANON KK·Filed 2024·Application pending·0 cites
- 1857US2024300236A1Liquid ejection head and liquid ejection apparatusCANON KK·Filed 2024·Application pending·0 cites
- 1956US12308136B2Copper alloy wire, plated wire, electric wire and cable using theseHITACHI METALS LTD·Filed 2021·Granted May 20, 2025·0 cites·16 claims
- 2056US2024286787A1Storage container for liquid cartridgeCANON KK·Filed 2023·Application pending·0 cites
- 2155US8049955B2Optical amplification apparatus, optical communication apparatus, and optical communication methodFUJITSU LTD·Filed 2008·Granted Nov 1, 2011·1 cites·4 claims
- 2252US6473345B2Semiconductor memory device which can be simultaneously tested even when the number of semiconductor memory devices is large and semiconductor wafer on which the semiconductor memory devices are formedMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Oct 29, 2002·7 cites·20 claims
- 2350US6831864B2Method of erasing data of nonvolatile semiconductor memory unitRENESAS TECH CORP·Filed 2003·Granted Dec 14, 2004·7 cites·4 claims
- 2447US6760259B1Non-volatile semiconductor memory device that can be fabricated with erasure unit modifiedRENESAS TECH CORP·Filed 2003·Granted Jul 6, 2004·5 cites·20 claims
- 2538US11053569B2Alloying-element additive and method of manufacturing copper alloyHITACHI METALS LTD·Filed 2016·Granted Jul 6, 2021·0 cites·3 claims
Join the waitlist — get patent alerts
Get an alert when Takashi Hayasaka files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →