Inventor · disambiguated record
So-Young Lim
Also filed as: LIM SO-YOUNG
15 granted patents·9 pending applications·54 citations·filing 2007–2025
90Inventor score
Top patents by PatentIndex Score
24 records- 0189US9869717B2Test pad structure, a pad structure for inspecting a semiconductor chip and a wiring substrate for a tape packaging having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Jan 16, 2018·6 cites·20 claims
- 0285US8436462B2Semiconductor housing package, semiconductor package structure including the semiconductor housing package, and processor-based system including the semiconductor package structureKIM DONG-HAN·Filed 2011·Granted May 7, 2013·9 cites·14 claims
- 0382US10699974B2Film for package substrate, semiconductor package, display device, and methods of fabricating the film, the semiconductor package, the display deviceSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jun 30, 2020·3 cites·11 claims
- 0482US8502084B2Semiconductor package including power ball matrix and power ring having improved power integritySONG EUN SEOK·Filed 2010·Granted Aug 6, 2013·7 cites·26 claims
- 0581US8384407B2Test pad structure, a pad structure for inspecting a semiconductor chip and a wiring subtrate for a tape package having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Feb 26, 2013·8 cites·16 claims
- 0680US9280182B2Chip on film package and display device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Mar 8, 2016·5 cites·20 claims
- 0780US7936232B2Substrate for semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2010·Granted May 3, 2011·5 cites·13 claims
- 0878US9059162B2Chip on film (COF) substrate, COF package and display device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Jun 16, 2015·5 cites·20 claims
- 0975US9437526B2Chip on film package including distributed via plugsSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Sep 6, 2016·4 cites·18 claims
- 1065US9059067B2Semiconductor device with interposer and method manufacturing sameCHOI YUN-SEOK·Filed 2011·Granted Jun 16, 2015·2 cites·16 claims
- 1163US2025349080A1Method and apparatus for generating three dimensions liver imagesSAMSUNG LIFE PUBLIC WELFARE FOUNDATION·Filed 2025·Application pending·0 cites
- 1261US11586079B2Film type package comprising a plurality of test lines and a plurality of first and second connection pads and display apparatus having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Feb 21, 2023·0 cites·8 claims
- 1360US10903127B2Film for a package substrateSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jan 26, 2021·0 cites·20 claims
- 1451US2012085383A1Solar cell module and method of manufacturing the sameCHO YOUNG-SANG·Filed 2011·Application pending·0 cites
- 1551US2012085393A1Solar cell module and method of manufacturing the sameCHO YOUNG-SANG·Filed 2011·Application pending·0 cites
- 1650US7760044B2Substrate for semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Jul 20, 2010·0 cites·19 claims
- 1750US2013127486A1Test Pad Structure, A Pad Structure For Inspecting A Semiconductor Chip And A Wiring Substrate For A Tape Package Having The SameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
- 1849US11231626B2Film type package comprising a plurality of test pads disposed on a plurality of margin areas and separated from a plurality of first connection pads by a cut lineSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jan 25, 2022·0 cites·13 claims
- 1948US2016162091A1Chip on film package and display device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Application pending·0 cites
- 2042US2016132513A1Device and method for providing poi information using poi groupingSK PLANET CO LTD·Filed 2014·Application pending·0 cites
- 2140US8581373B2Tape packageKIM DONG-HAN·Filed 2011·Granted Nov 12, 2013·0 cites·33 claims
- 2240US2012126431A1Semiconductor packageKIM YONG-HOON·Filed 2011·Application pending·0 cites
- 2339US2012138968A1Semiconductor package and display panel assembly having the sameSHIN NA-RAE·Filed 2011·Application pending·0 cites
- 2437US2016351155A1Chip on film package and display device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →