Inventor · disambiguated record
Mahiro Tsujino
Also filed as: TSUJINO MAHIRO
9 granted patents·1 pending application·24 citations·filing 2008–2014
82Inventor score
Technology areasH10W
Top patents by PatentIndex Score
10 records- 0184US9640452B2Electronic component housing package and electronic deviceKYOCERA CORP·Filed 2014·Granted May 2, 2017·8 cites·5 claims
- 0278US8653649B2Device housing package and mounting structureTSUJINO MAHIRO·Filed 2010·Granted Feb 18, 2014·10 cites·8 claims
- 0362US9408307B2Device housing packageKYOCERA CORP·Filed 2013·Granted Aug 2, 2016·2 cites·8 claims
- 0458US9386687B2Electronic component housing package and electronic apparatusKYOCERA CORP·Filed 2012·Granted Jul 5, 2016·1 cites·6 claims
- 0558US8344259B2Connection terminal, package using the same, and electronic apparatusKYOCERA CORP·Filed 2008·Granted Jan 1, 2013·2 cites·10 claims
- 0656US9491873B2Element housing package, component for semiconductor device, and semiconductor deviceTSUJINO MAHIRO·Filed 2012·Granted Nov 8, 2016·1 cites·6 claims
- 0744US2011048796A1Connector, Package Using the Same and Electronic DeviceKYOCERA CORP·Filed 2009·Application pending·0 cites
- 0842US9443777B2Semiconductor element housing package, semiconductor device, and mounting structureKYOCERA CORP·Filed 2013·Granted Sep 13, 2016·0 cites·5 claims
- 0938US9078347B2Electronic component housing unit, electronic module, and electronic deviceTSUJINO MAHIRO·Filed 2011·Granted Jul 7, 2015·0 cites·7 claims
- 1031US8952518B2Semiconductor device housing package, and semiconductor apparatus and electronic apparatus including the sameTSUJINO MAHIRO·Filed 2012·Granted Feb 10, 2015·0 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →