Inventor · disambiguated record
James L. Oborny
Also filed as: OBORNY JAMES L
4 granted patents·36 citations·filing 2004–2018
72Inventor score
Top patents by PatentIndex Score
4 records- 0193US8344749B2Through carrier dual side loop-back testing of TSV die after die attach to substrateTEXAS INSTRUMENTS INC·Filed 2010·Granted Jan 1, 2013·23 cites·22 claims
- 0278US8471577B2Lateral coupling enabled topside only dual-side testing of TSV die attached to package substrateSTILLMAN DANIEL JOSEPH·Filed 2010·Granted Jun 25, 2013·8 cites·23 claims
- 0347US6943573B1System and method for site-to-site yield comparison while testing integrated circuit diesTEXAS INSTRUMENTS INC·Filed 2004·Granted Sep 13, 2005·5 cites·22 claims
- 0435US10962571B2Interposers having cuts through an insulating substrateTEXAS INSTRUMENTS INC·Filed 2018·Granted Mar 30, 2021·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →