Inventor · disambiguated record
Hui-Shen Shih
Also filed as: SHIH HUI-SHEN
30 granted patents·13 pending applications·78 citations·filing 2000–2016
95Inventor score
Top patents by PatentIndex Score
43 records- 0188US8035191B2Contact efuse structureUNITED MICROELECTRONICS CORP·Filed 2008·Granted Oct 11, 2011·19 cites·14 claims
- 0284US8134192B2Integrated structure of MEMS device and CMOS image sensor deviceSHIH HUI-SHEN·Filed 2010·Granted Mar 13, 2012·3 cites·6 claims
- 0382US8071412B2Method of fabricating micro-electromechanical system microphone structureSHIH HUI-SHEN·Filed 2010·Granted Dec 6, 2011·3 cites·11 claims
- 0481US7851247B2Method of fabricating micro-electromechanical system microphone structureUNITED MICROELECTRONICS CORP·Filed 2008·Granted Dec 14, 2010·8 cites·5 claims
- 0578US8072036B2Micro-electromechanical system microphone structureSHIH HUI-SHEN·Filed 2010·Granted Dec 6, 2011·3 cites·12 claims
- 0676US7833818B2Integrated structure of MEMS device and CMOS image sensor device and fabricating method thereofUNITED MICROELECTRONICS CORP·Filed 2008·Granted Nov 16, 2010·3 cites·14 claims
- 0775US8101987B2Semiconductor device and method of fabricating the sameSHIH HUI-SHEN·Filed 2010·Granted Jan 24, 2012·2 cites·6 claims
- 0872US7957827B2Method of controlling statuses of wafersUNITED MICROELECTRONICS CORP·Filed 2007·Granted Jun 7, 2011·4 cites·3 claims
- 0971US7795056B2Semiconductor device and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2008·Granted Sep 14, 2010·4 cites·18 claims
- 1071US7662645B2Reworked integrated circuit device and reworking method thereofUNITED MICROELECTRONICS CORP·Filed 2007·Granted Feb 16, 2010·3 cites·13 claims
- 1167US7557025B2Method of etching a dielectric layer to form a contact hole and a via hole and damascene methodUNITED MICROELECTRONICS CORP·Filed 2005·Granted Jul 7, 2009·2 cites·32 claims
- 1266US8134215B2MEMS diaphragmSHIH HUI-SHEN·Filed 2008·Granted Mar 13, 2012·3 cites·7 claims
- 1364US7828625B2Method of supplying polishing liquidUNITED MICROELECTRONICS CORP·Filed 2007·Granted Nov 9, 2010·4 cites·14 claims
- 1462US8142258B2Method of transferring a waferYANG KUO-WEI·Filed 2010·Granted Mar 27, 2012·2 cites·16 claims
- 1561US6416615B1Device for detecting abnormality in chemical-mechanical polishing operationUNITED MICROELECTRONICS CORP·Filed 2000·Granted Jul 9, 2002·8 cites·9 claims
- 1657US9281238B2Method for fabricating interlayer dielectric layerUNITED MICROELECTRONICS CORP·Filed 2014·Granted Mar 8, 2016·0 cites·7 claims
- 1754US7909677B2Method of transferring a waferUNITED MICROELECTRONICS CORP·Filed 2007·Granted Mar 22, 2011·1 cites·6 claims
- 1853US9564507B2Interlayer dielectric layer with two tensile dielectric layersUNITED MICROELECTRONICS CORP·Filed 2016·Granted Feb 7, 2017·0 cites·5 claims
- 1952US2010144156A1Method to integrate micro electro mechanical system and cmos image sensorSHIH HUI-SHEN·Filed 2008·Application pending·0 cites
- 2051US8492857B2MEMS diaphragmSHIH HUI-SHEN·Filed 2011·Granted Jul 23, 2013·0 cites·8 claims
- 2151US8390085B2MEMS diaphragmSHIH HUI-SHEN·Filed 2011·Granted Mar 5, 2013·0 cites·6 claims
- 2251US7967960B2Fluid-confining apparatusUNITED MICROELECTRONICS CORP·Filed 2007·Granted Jun 28, 2011·0 cites·3 claims
- 2350US2012043199A9Fluid-confining apparatus and method of operating the sameSHIH HUI-SHEN·Filed 2008·Application pending·0 cites
- 2449US7731572B2CMP headUNITED MICROELECTRONICS CORP·Filed 2007·Granted Jun 8, 2010·1 cites·35 claims
- 2549US2009117835A1Expandable polishing platen deviceSHIH HUI-SHEN·Filed 2007·Application pending·0 cites
- 2648US8674463B2Multifunction MEMS element and integrated method for making MOS and multifunction MEMSSHIH HUI-SHEN·Filed 2009·Granted Mar 18, 2014·0 cites·14 claims
- 2748US2009120785A1Method for forming metal film or stacked layer including metal film with reduced surface roughnessUNITED MICROELECTRONICS CORP·Filed 2009·Application pending·0 cites
- 2847US7008302B2Chemical mechanical polishing equipment and conditioning thereofUNITED MICROELECTRONICS CORP·Filed 2004·Granted Mar 7, 2006·5 cites·11 claims
- 2947US2010068832A1Method for the protection of information in multi-project wafersSHIH HUI-SHEN·Filed 2008·Application pending·0 cites
- 3046US2009285419A1Microelectromechanical system microphoneUNITED MICROELECTRONICS CORP·Filed 2008·Application pending·0 cites
- 3144US7732332B2Chemical mechanical polishing method with inspection pre and post processingUNITED MICROELECTRONICS CORP·Filed 2006·Granted Jun 8, 2010·0 cites·8 claims
- 3244US2008305609A1Method for forming a seamless shallow trench isolationSHIH HUI-SHEN·Filed 2007·Application pending·0 cites
- 3343US7732009B2Method of cleaning reaction chamber, method of forming protection film and protection waferUNITED MICROELECTRONICS CORP·Filed 2006·Granted Jun 8, 2010·0 cites·15 claims
- 3443US2015228788A1Stress memorization process and semiconductor structure including contact etch stop layerUNITED MICROELECTRONICS CORP·Filed 2014·Application pending·0 cites
- 3542US7510964B2Method for manufacturing semiconductor device that includes baking a dielectric layer after exposure to plasmaUNITED MICROELECTRONICS CORP·Filed 2006·Granted Mar 31, 2009·0 cites·27 claims
- 3642US2007144892A1Method for forming metal film or stacked layer including metal film with reduced surface roughnessSHIH HUI-SHEN·Filed 2005·Application pending·0 cites
- 3742US2009123877A1Method for forming an opening of nano-meter scaleSHIH HUI-SHEN·Filed 2007·Application pending·0 cites
- 3841US2007072356A1Method for reducing positive charges accumulated on chips during ion implantationSHIH HUI-SHEN·Filed 2005·Application pending·0 cites
- 3939US2009107527A1Method of cleaning transparent device in a thermal process apparatus, thermal process apparatus and process using the same thermal process apparatusUNITED MICROELECTRONICS CORP·Filed 2007·Application pending·0 cites
- 4038US2009023368A1Polishing head and edge control ring thereof, and method of increasing polishing rate at wafer edgeUNITED MICROELECTRONICS CORP·Filed 2007·Application pending·0 cites
- 4136US8431473B2Method for fabricating semiconductor deviceHU SHU-HUI·Filed 2011·Granted Apr 30, 2013·0 cites·20 claims
- 4236US7482244B2Method of preventing a peeling issue of a high stressed thin filmUNITED MICROELECTRONICS CORP·Filed 2005·Granted Jan 27, 2009·0 cites·17 claims
- 4335US6267654B1Pad backer for polishing head of chemical mechanical polishing machineUNITED MICROELECTRONICS CORP·Filed 2000·Granted Jul 31, 2001·0 cites·5 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →