Inventor · disambiguated record
Yu-Kung Hsiao
Also filed as: HSIAO YU-KUNG
19 granted patents·1 pending application·635 citations·filing 1999–2008
96Inventor score
Top patents by PatentIndex Score
20 records- 0198US6821810B1High transmittance overcoat for optimization of long focal length microlens arrays in semiconductor color imagersTAIWAN SEMICONDUCTOR MFG·Filed 2000·Granted Nov 23, 2004·166 cites·18 claims
- 0293US6395576B1High efficiency color filter process to improve color balance in semiconductor array imaging devicesTAIWAN SEMICONDUCTOR MFG·Filed 2000·Granted May 28, 2002·89 cites·16 claims
- 0389US6171883B1Image array optoelectronic microelectronic fabrication with enhanced optical stability and method for fabrication thereofTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted Jan 9, 2001·95 cites·6 claims
- 0488US6582988B1Method for forming micro lens structuresTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Jun 24, 2003·48 cites·15 claims
- 0585US6417022B1Method for making long focal length micro-lens for color filtersTAIWAN SEMICONDUCTOR MFG·Filed 2000·Granted Jul 9, 2002·44 cites·12 claims
- 0684US7009772B2High transmittance overcoat for microlens arrays in semiconductor color imagersTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Mar 7, 2006·33 cites·41 claims
- 0782US6531266B1Rework procedure for the microlens element of a CMOS image sensorTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Mar 11, 2003·32 cites·16 claims
- 0876US6849533B2Method for fabricating microelectronic product with attenuated bond pad corrosionTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Feb 1, 2005·25 cites·17 claims
- 0976US6590239B2Color filter image array optoelectronic microelectronic fabrication with a planarizing layer formed upon a concave surfaced color filter regionTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Jul 8, 2003·31 cites·14 claims
- 1075US7372497B2Effective method to improve sub-micron color filter sensitivityTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted May 13, 2008·23 cites·37 claims
- 1174US7507598B2Image sensor fabrication method and structureTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Mar 24, 2009·6 cites·12 claims
- 1268US6956253B2Color filter with resist material in scribe linesTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Oct 18, 2005·13 cites·8 claims
- 1359US6878642B1Method to improve passivation openings by reflow of photoresist to eliminate tape residueTAIWAN SEMICONDUCTOR MFG·Filed 2000·Granted Apr 12, 2005·9 cites·20 claims
- 1457US7071032B2Material to improve image sensor yield during wafer sawingTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Jul 4, 2006·5 cites·16 claims
- 1557US6623912B1Method to form the ring shape contact to cathode on wafer edge for electroplating in the bump process when using the negative type dry film photoresistTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Sep 23, 2003·7 cites·39 claims
- 1652US6759276B1Material to improve CMOS image sensor yield during wafer sawingTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Jul 6, 2004·4 cites·7 claims
- 1751US8129762B2Image sensorWENG FU-TIEN·Filed 2008·Granted Mar 6, 2012·0 cites·21 claims
- 1849US6511779B1Method for fabricating high resolution color filter image array optoelectronic microelectronic fabricationTAIWAN SEMICONDUCTOR MFG·Filed 2000·Granted Jan 28, 2003·5 cites·17 claims
- 1937US6660641B1Method for forming crack resistant planarizing layer within microelectronic fabricationTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Dec 9, 2003·0 cites·15 claims
- 2033US2002063214A1Optoelectronic microelectronic fabrication with infrared filter and method for fabrication thereofTAIWAN SEMICONDUCTOR MFG·Filed 2000·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →