Inventor · disambiguated record
Thorsten Lill
Also filed as: LILL THORSTEN · LILL THORSTEN B · LILL THORSTEN BERND
106 granted patents·34 pending applications·2,589 citations·filing 1998–2025
99Inventor score
Top patents by PatentIndex Score
140 records- 0199US9431268B2Isotropic atomic layer etch for silicon and germanium oxidesLAM RES CORP·Filed 2015·Granted Aug 30, 2016·135 cites·20 claims
- 0299US6924191B2Method for fabricating a gate structure of a field effect transistorAPPLIED MATERIALS INC·Filed 2003·Granted Aug 2, 2005·452 cites·20 claims
- 0398US9870899B2Cobalt etch backLAM RES CORP·Filed 2015·Granted Jan 16, 2018·32 cites·19 claims
- 0498US9805941B2Integrating atomic scale processes: ALD (atomic layer deposition) and ALE (atomic layer etch)LAM RES CORP·Filed 2017·Granted Oct 31, 2017·44 cites·26 claims
- 0598US9806252B2Dry plasma etch method to pattern MRAM stackLAM RES CORP·Filed 2015·Granted Oct 31, 2017·61 cites·20 claims
- 0698US9576811B2Integrating atomic scale processes: ALD (atomic layer deposition) and ALE (atomic layer etch)LAM RES CORP·Filed 2015·Granted Feb 21, 2017·65 cites·26 claims
- 0798US9406535B2Ion injector and lens system for ion beam millingLAM RES CORP·Filed 2014·Granted Aug 2, 2016·33 cites·17 claims
- 0898US9257638B2Method to etch non-volatile metal materialsLAM RES CORP·Filed 2014·Granted Feb 9, 2016·55 cites·18 claims
- 0998US9034199B2Ceramic article with reduced surface defect density and process for producing a ceramic articleAPPLIED MATERIALS INC·Filed 2012·Granted May 19, 2015·47 cites·20 claims
- 1097US11380556B2Thermal atomic layer etch with rapid temperature cyclingLAM RES CORP·Filed 2020·Granted Jul 5, 2022·3 cites·16 claims
- 1197US10374144B2Dry plasma etch method to pattern MRAM stackLAM RES CORP·Filed 2017·Granted Aug 6, 2019·21 cites·16 claims
- 1297US10186426B2Integrating atomic scale processes: ALD (atomic layer deposition) and ale (atomic layer etch)LAM RES CORP·Filed 2017·Granted Jan 22, 2019·16 cites·21 claims
- 1397US10096487B2Atomic layer etching of tungsten and other metalsLAM RES CORP·Filed 2016·Granted Oct 9, 2018·24 cites·16 claims
- 1497US9779955B2Ion beam etching utilizing cryogenic wafer temperaturesLAM RES CORP·Filed 2016·Granted Oct 3, 2017·21 cites·18 claims
- 1597US9130158B1Method to etch non-volatile metal materialsLAM RES CORP·Filed 2014·Granted Sep 8, 2015·44 cites·19 claims
- 1697US8382999B2Pulsed plasma high aspect ratio dielectric processAPPLIED MATERIALS INC·Filed 2010·Granted Feb 26, 2013·55 cites·9 claims
- 1797US6081334AEndpoint detection for semiconductor processesAPPLIED MATERIALS INC·Filed 1998·Granted Jun 27, 2000·251 cites·34 claims
- 1896US10749103B2Dry plasma etch method to pattern MRAM stackLAM RES CORP·Filed 2019·Granted Aug 18, 2020·7 cites·10 claims
- 1996US10580628B2Differentially pumped reactive gas injectorLAM RES CORP·Filed 2017·Granted Mar 3, 2020·8 cites·19 claims
- 2096US9536748B2Use of ion beam etching to generate gate-all-around structureLAM RES CORP·Filed 2014·Granted Jan 3, 2017·22 cites·29 claims
- 2196US9245761B2Internal plasma grid for semiconductor fabricationLAM RES CORP·Filed 2013·Granted Jan 26, 2016·21 cites·19 claims
- 2295US11062920B2Ion injector and lens system for ion beam millingLAM RES CORP·Filed 2018·Granted Jul 13, 2021·8 cites·14 claims
- 2395US9984858B2ALE smoothness: in and outside semiconductor industryLAM RES CORP·Filed 2016·Granted May 29, 2018·10 cites·20 claims
- 2495US9953843B2Chamber for patterning non-volatile metalsLAM RES CORP·Filed 2016·Granted Apr 24, 2018·15 cites·21 claims
- 2595US9916993B2Ion injector and lens system for ion beam millingLAM RES CORP·Filed 2016·Granted Mar 13, 2018·9 cites·13 claims
- 2695US6074954AProcess for control of the shape of the etch front in the etching of polysiliconAPPLIED MATERIALS INC·Filed 1998·Granted Jun 13, 2000·155 cites·15 claims
- 2794US10784086B2Cobalt etch backLAM RES CORP·Filed 2017·Granted Sep 22, 2020·9 cites·14 claims
- 2894US10515816B2Integrating atomic scale processes: ALD (atomic layer deposition) and ALE (atomic layer etch)LAM RES CORP·Filed 2018·Granted Dec 24, 2019·6 cites·18 claims
- 2994US10403476B2Active showerheadLAM RES CORP·Filed 2016·Granted Sep 3, 2019·9 cites·19 claims
- 3094US10141163B2Controlling ion energy within a plasma chamberLAM RES CORP·Filed 2016·Granted Nov 27, 2018·8 cites·20 claims
- 3194US8617347B2Vacuum processing chambers incorporating a moveable flow equalizerKIM JISOO·Filed 2009·Granted Dec 31, 2013·35 cites·12 claims
- 3293US10224221B2Internal plasma grid for semiconductor fabricationLAM RES CORP·Filed 2016·Granted Mar 5, 2019·7 cites·20 claims
- 3393US9837254B2Differentially pumped reactive gas injectorLAM RES CORP·Filed 2014·Granted Dec 5, 2017·12 cites·25 claims
- 3493US9460894B2Controlling ion energy within a plasma chamberLAM RES CORP·Filed 2013·Granted Oct 4, 2016·11 cites·20 claims
- 3592US8709953B2Pulsed plasma with low wafer temperature for ultra thin layer etchesAPPLIED MATERIALS INC·Filed 2012·Granted Apr 29, 2014·12 cites·10 claims
- 3692US6905800B1Etching a substrate in a process zoneFiled 2000·Granted Jun 14, 2005·64 cites·54 claims
- 3791US10256108B2Atomic layer etching of AL2O3 using a combination of plasma and vapor treatmentsLAM RES CORP·Filed 2017·Granted Apr 9, 2019·7 cites·18 claims
- 3891US6406924B1Endpoint detection in the fabrication of electronic devicesAPPLIED MATERIALS INC·Filed 1999·Granted Jun 18, 2002·93 cites·96 claims
- 3989US10825652B2Ion beam etch without need for wafer tilt or rotationLAM RES CORP·Filed 2015·Granted Nov 3, 2020·5 cites·10 claims
- 4089US10727073B2Atomic layer etching 3D structures: Si and SiGe and Ge smoothness on horizontal and vertical surfacesLAM RES CORP·Filed 2017·Granted Jul 28, 2020·5 cites·20 claims
- 4189US10304659B2Ale smoothness: in and outside semiconductor industryLAM RES CORP·Filed 2018·Granted May 28, 2019·4 cites·20 claims
- 4289US9257293B2Methods of forming silicon nitride spacersAPPLIED MATERIALS INC·Filed 2014·Granted Feb 9, 2016·10 cites·20 claims
- 4389US7846845B2Integrated method for removal of halogen residues from etched substrates in a processing systemAPPLIED MATERIALS INC·Filed 2007·Granted Dec 7, 2010·16 cites·27 claims
- 4488US12280091B2Etch selectivity control in atomic layer etchingLAM RES CORP·Filed 2021·Granted Apr 22, 2025·1 cites·30 claims
- 4588US9735069B2Method and apparatus for determining process rateLAM RES CORP·Filed 2015·Granted Aug 15, 2017·5 cites·13 claims
- 4688US9553031B1Method for integrating germanides in high performance integrated circuitsLAM RES CORP·Filed 2016·Granted Jan 24, 2017·5 cites·23 claims
- 4788US7067432B2Methodology for in-situ and real-time chamber condition monitoring and process recovery during plasma processingAPPLIED MATERIALS INC·Filed 2003·Granted Jun 27, 2006·29 cites·14 claims
- 4887US10804079B2Active showerheadLAM RES CORP·Filed 2019·Granted Oct 13, 2020·3 cites·18 claims
- 4987US9320387B2Sulfur doped carbon hard masksLAM RES CORP·Filed 2014·Granted Apr 26, 2016·6 cites·17 claims
- 5087US6583065B1Sidewall polymer forming gas additives for etching processesAPPLIED MATERIALS INC·Filed 1999·Granted Jun 24, 2003·105 cites·13 claims
Showing the top 50 of 140 patent records by PatentIndex Score.
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