Inventor · disambiguated record
Makoto Dobashi
Also filed as: DOBASHI MAKOTO
22 granted patents·12 pending applications·286 citations·filing 1997–2014
96Inventor score
Files withMITSUI MINING & SMELTING CO22SAMSUNG ELECTRO MECH3YASUDA KIYOTAKA2DOBASHI MAKOTO1MATSUDA MITSUYOSHI1
Top patents by PatentIndex Score
34 records- 0185US6183880B1Composite foil of aluminum and copperMITSUI MINING & SMELTING CO·Filed 1998·Granted Feb 6, 2001·46 cites·26 claims
- 0283US8715836B2Surface-treated electro-deposited copper foil and method for manufacturing the sameDOBASHI MAKOTO·Filed 2007·Granted May 6, 2014·7 cites·22 claims
- 0382US6335099B1Corrosion resistant, magnesium-based product exhibiting luster of base metal and method for producing the sameMITSUI MINING & SMELTING CO·Filed 1999·Granted Jan 1, 2002·37 cites·14 claims
- 0481US5958209AHigh tensile strength electrodeposited copper foil and process of electrodepositing thereofMITSUI MINING & SMELTING CO·Filed 1997·Granted Sep 28, 1999·33 cites·6 claims
- 0580US6541126B1Electrolytic copper foil with carrier foil and copper-clad laminate using the electrolytic copper foilMITSUI MINING & SMELTING CO·Filed 2000·Granted Apr 1, 2003·30 cites·5 claims
- 0678US7811709B2Negative electrode for nonaqueous secondary battery, process of producing the negative electrode, and nonaqueous secondary batteryMITSUI MINING & SMELTING CO·Filed 2003·Granted Oct 12, 2010·18 cites·32 claims
- 0774US8722199B2Electrodeposited copper foil, its manufacturing method, surface-treated electrodeposited copper foil using the electrodeposited copper foil, and copper-clad laminate and printed wiring board using the surface-treated electrodeposited copper foilMATSUDA MITSUYOSHI·Filed 2006·Granted May 13, 2014·7 cites·15 claims
- 0871US6777108B1Electrolytic copper foil with carrier foil and method for manufacturing the same and copper-clad laminate using the electrolytic copper foil with carrier foilMITSUI MINING & SMELTING CO·Filed 2000·Granted Aug 17, 2004·20 cites·9 claims
- 0971US6610418B1Electolytic copper foil with carrier foil and method for manufacturing the sameMITSUI MINING & SMELTING CO·Filed 2000·Granted Aug 26, 2003·7 cites·7 claims
- 1068US8419920B2Method of preparing electrolytic copper solution acidified with sulfuric acid, sulfuric-acid-acidified electrolytic copper solution prepared by the preparation method, and electrodeposited copper filmTOMONAGA SAKIKO·Filed 2007·Granted Apr 16, 2013·1 cites·11 claims
- 1167US6649274B1Electrolytic copper foil with carrier foil and copper-clad laminate using the electrolytic copper foil with carrier foilMITSUI MINING & SMELTING CO·Filed 2000·Granted Nov 18, 2003·13 cites·2 claims
- 1265US6544664B1Copper foil for printed wiring boardMITSUI MINING & SMELTING CO·Filed 2000·Granted Apr 8, 2003·12 cites·4 claims
- 1364US6652725B2Electrodeposition apparatus for producing electrodeposited copper foil and electrodeposited copper foil produced by the apparatusMITSUI MINING & SMELTING CO·Filed 2001·Granted Nov 25, 2003·4 cites·27 claims
- 1463US6194056B1High tensile strength electrodeposited copper foilMITSUI MINING & SMELTING CO·Filed 1999·Granted Feb 27, 2001·13 cites·8 claims
- 1560US7524552B2Copper foil provided with dielectric layer for forming capacitor layer, copper clad laminate for formation of capacitor layer using such copper foil with dielectric layer, and method for manufacturing producing such copper foil with dielectric layer for formation of capacitor layerMITSUI MINING & SMELTING CO·Filed 2003·Granted Apr 28, 2009·8 cites·29 claims
- 1660US7455931B2Negative electrode for non-aqueous electrolyte secondary cell and method for manufacture thereof, and non-aqueous electrolyte secondary cellMITSUI MINING & SMELTING CO·Filed 2003·Granted Nov 25, 2008·4 cites·16 claims
- 1757US7217464B2Method of manufacturing electrodeposited copper foil with carrier foil for high-temperature heat-resistance and electrodeposited copper foil with carrier foil for high-temperature heat-resistance obtained by the manufacturing methodMITSUI MINING & SMELTING CO·Filed 2003·Granted May 15, 2007·2 cites·15 claims
- 1857US6835297B1High current density electrolytic decomposition process for copperMITSUI MINING & SMELTING CO·Filed 2000·Granted Dec 28, 2004·1 cites·19 claims
- 1955US9307639B2Electro-deposited copper foil, surface-treated copper foil using the electro-deposited copper foil and copper clad laminate using the surface-treated copper foil, and a method for manufacturing the electro-deposited copper foilSAKAI HISAO·Filed 2007·Granted Apr 5, 2016·1 cites·29 claims
- 2051US2009166213A1Production method of electro-deposited copper foil, electro-deposited copper foil obtained by the production method, surface-treated copper foil obtained by using the electro-deposited copper foil and copper-clad laminate obtained by using the electro-deposited copper foil or the surface-treated copper foilMITSUI MINING & SMELTING CO·Filed 2006·Application pending·0 cites
- 2149US2015101848A1Surface-treated copper foil and copper-clad laminate plate including the same, printed curcuit board using the same, and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 2248US6322904B1Copper foil for printed circuit boardsMITSUI MINING & SMELTING CO·Filed 1997·Granted Nov 27, 2001·13 cites·11 claims
- 2348US2015156887A1Method of forming amorphous alloy film and printed wiring board manufactured by the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 2446US6984453B2Electrolyte copper foil having carrier foil, manufacturing method thereof, and layered plate using the electrolyte copper foil having carrier foilMITSUI MINING & SMELTING CO·Filed 2002·Granted Jan 10, 2006·7 cites·22 claims
- 2546US2015267305A1Etchant composition and method for manufacturing circuit pattern using the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 2644US2006147802A1Anode for nonaqueous secondary battery, process of producing the anode, and nonaqueous secondary batteryYASUDA KIYOTAKA·Filed 2005·Application pending·0 cites
- 2743US2006087794A1Capacitor layer forming material, method of manufacturing a composite foil used where manufacturing the same, and print wiring board having a circuit where a capacitor is embedded, obtained by using the sameMITSUI MINING & SMELTING CO·Filed 2005·Application pending·0 cites
- 2843US2005208379A1Negative electrode for nonaqueous secondary battery, process of producing the negative electrode, and nonaqueous secondary batteryMUSHA SHINICHI·Filed 2005·Application pending·0 cites
- 2941US2002064019A1Cathode electrode material and rotating cathode drum for electrolytic copper foil production using the sameFiled 2001·Application pending·0 cites
- 3040US2006115735A1Negative electrode for nonaqueous electrolyte secondary battery, method for manufacturing same and nonaqueous electrolyte secondary batteryYASUDA KIYOTAKA·Filed 2003·Application pending·0 cites
- 3139US2005161149A1Method of forming polymide coating containing dielectric filler on surface of metallic material process for producing copper clad laminate for formation of capacitor layer for printed wiring board and copper clad laminate obtained by the processMITSUI MINING & SMELTING CO·Filed 2003·Application pending·0 cites
- 3237US2004188263A1Copper foil with carrier foil, process for producing the same and copper clad laminate including the copper foil with carrier foilFiled 2003·Application pending·0 cites
- 3331US6071629AOrganic rust-proof treated copper foilMITSUI MINING & SMELTING CO·Filed 1997·Granted Jun 6, 2000·2 cites·10 claims
- 3431US2001019780A1Metal foil with carrier and method for manufacturing the sameMITSUI MINING & SMELTING CO·Filed 2001·Application pending·0 cites
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