Inventor · disambiguated record
Mei-Lin Chan
Also filed as: CHAN MEI-LIN
16 granted patents·5 pending applications·56 citations·filing 2005–2021
89Inventor score
Top patents by PatentIndex Score
21 records- 0193US11460957B2Ultrasonic fingerprint sensor with a contact layer of non-uniform thicknessINVENSENSE INC·Filed 2021·Granted Oct 4, 2022·3 cites·15 claims
- 0282US11176345B2Ultrasonic fingerprint sensor with a contact layer of non-uniform thicknessINVENSENSE INC·Filed 2020·Granted Nov 16, 2021·2 cites·23 claims
- 0382US9802815B2Method for MEMS structure with dual-level structural layer and acoustic portINVENSENSE INC·Filed 2015·Granted Oct 31, 2017·4 cites·9 claims
- 0481US9809451B2Capacitive sensing structure with embedded acoustic channelsINVENSENSE INC·Filed 2015·Granted Nov 7, 2017·2 cites·19 claims
- 0580US9216897B2Capacitive sensing structure with embedded acoustic channelsINVENSENSE INC·Filed 2013·Granted Dec 22, 2015·3 cites·21 claims
- 0680USD528093SRotatable camera mobile phoneASMOBILE COMM INC·Filed 2005·Granted Sep 12, 2006·36 cites·1 claims
- 0778US11216632B2Ultrasonic fingerprint sensor with a contact layer of non-uniform thicknessINVENSENSE INC·Filed 2020·Granted Jan 4, 2022·2 cites·22 claims
- 0871US11515465B2EMI reduction in piezoelectric micromachined ultrasound transducer arrayINVENSENSE INC·Filed 2019·Granted Nov 29, 2022·1 cites·20 claims
- 0971US9344808B2Differential sensing acoustic sensorINVENSENSE INC·Filed 2014·Granted May 17, 2016·3 cites·30 claims
- 1065US11682228B2Ultrasonic fingerprint sensor with a contact layer of non-uniform thicknessINVENSENSE INC·Filed 2021·Granted Jun 20, 2023·0 cites·20 claims
- 1153US2023203421A1Low intensity vibration system and method for bioprocessingUNIV NEW YORK STATE RES FOUND·Filed 2021·Application pending·0 cites
- 1252US11995909B2Multipath reflection correctionTDK CORP·Filed 2021·Granted May 28, 2024·0 cites·20 claims
- 1352US11517938B2Reflection minimization for sensorINVENSENSE INC·Filed 2018·Granted Dec 6, 2022·0 cites·24 claims
- 1450US11188735B2Fake finger detection using ridge featuresINVENSENSE INC·Filed 2020·Granted Nov 30, 2021·0 cites·17 claims
- 1550US9227842B2Method for MEMS structure with dual-level structural layer and acoustic portINVENSENSE INC·Filed 2013·Granted Jan 5, 2016·0 cites·13 claims
- 1648US7944779B2Multifunction time display devicePEGATRON CORP·Filed 2009·Granted May 17, 2011·0 cites·14 claims
- 1746US2020367858A1Dual layer ultrasonic transducerINVENSENSE INC·Filed 2020·Application pending·0 cites
- 1846US2022043993A1Ultrasonic sensor with receive beamformingTDK CORP·Filed 2021·Application pending·0 cites
- 1944US2020134280A1Fingerprint SensorINVENSENSE INC·Filed 2019·Application pending·0 cites
- 2042US2006132645A1Electronic communication deviceCHANG YU-CHUAN·Filed 2005·Application pending·0 cites
- 2138US11623246B2Piezoelectric micromachined ultrasound transducer device with piezoelectric barrier layerINVENSENSE INC·Filed 2019·Granted Apr 11, 2023·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →