Inventor · disambiguated record
David Jon Hiner
Also filed as: HINER DAVID · HINER DAVID J · HINER DAVID JON
89 granted patents·6 pending applications·2,549 citations·filing 2002–2025
99Inventor score
Files withAMKOR TECHNOLOGY INC58AMKOR TECH SINGAPORE HOLDING PTE LTD15HINER DAVID JON7HUEMOELLER RONALD PATRICK5HINER DAVID J3
Top patents by PatentIndex Score
95 records- 0199US7671457B1Semiconductor package including top-surface terminals for mounting another semiconductor packageAMKOR TECHNOLOGY INC·Filed 2006·Granted Mar 2, 2010·233 cites·12 claims
- 0299US7548430B1Buildup dielectric and metallization process and semiconductor packageAMKOR TECHNOLOGY INC·Filed 2006·Granted Jun 16, 2009·202 cites·19 claims
- 0399US7185426B1Method of manufacturing a semiconductor packageAMKOR TECHNOLOGY INC·Filed 2004·Granted Mar 6, 2007·395 cites·20 claims
- 0498US11424155B2Semiconductor device package and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Aug 23, 2022·4 cites·20 claims
- 0598US10074630B2Semiconductor package with high routing density patchAMKOR TECHNOLOGY INC·Filed 2015·Granted Sep 11, 2018·27 cites·20 claims
- 0698US9653428B1Semiconductor package and fabricating method thereofAMKOR TECHNOLOGY INC·Filed 2016·Granted May 16, 2017·132 cites·20 claims
- 0798US9543242B1Semiconductor package and fabricating method thereofAMKOR TECHNOLOGY INC·Filed 2015·Granted Jan 10, 2017·73 cites·20 claims
- 0898US8341835B1Buildup dielectric layer having metallization pattern semiconductor package fabrication methodAMKOR TECHNOLOGY INC·Filed 2009·Granted Jan 1, 2013·71 cites·20 claims
- 0998US7572681B1Embedded electronic component packageAMKOR TECHNOLOGY INC·Filed 2005·Granted Aug 11, 2009·103 cites·19 claims
- 1098US7361533B1Stacked embedded leadframeAMKOR TECHNOLOGY INC·Filed 2005·Granted Apr 22, 2008·96 cites·20 claims
- 1197US11901335B2Semiconductor package with routing patch and conductive interconnection structures laterally displaced from routing patchAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2022·Granted Feb 13, 2024·2 cites·18 claims
- 1297US9349681B1Semiconductor device package and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2015·Granted May 24, 2016·16 cites·20 claims
- 1397US8432022B1Shielded embedded electronic component substrate fabrication method and structureHUEMOELLER RONALD PATRICK·Filed 2009·Granted Apr 30, 2013·65 cites·16 claims
- 1497US8026587B1Semiconductor package including top-surface terminals for mounting another semiconductor packageAMKOR TECHNOLOGY INC·Filed 2010·Granted Sep 27, 2011·24 cites·17 claims
- 1597US7692286B1Two-sided fan-out wafer escape packageAMKOR TECHNOLOGY INC·Filed 2008·Granted Apr 6, 2010·68 cites·20 claims
- 1697US7420272B1Two-sided wafer escape packageAMKOR TECHNOLOGY INC·Filed 2007·Granted Sep 2, 2008·76 cites·20 claims
- 1797US7247523B1Two-sided wafer escape packageAMKOR TECHNOLOGY INC·Filed 2005·Granted Jul 24, 2007·81 cites·12 claims
- 1896US11289451B2Semiconductor package with high routing density patchAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Mar 29, 2022·3 cites·22 claims
- 1996US10192816B2Semiconductor package and fabricating method thereofAMKOR TECHNOLOGY INC·Filed 2017·Granted Jan 29, 2019·15 cites·18 claims
- 2096US9966300B1Semiconductor device package and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2015·Granted May 8, 2018·13 cites·20 claims
- 2196US8188584B1Direct-write wafer level chip scale packageBERRY CHRISTOPHER JOHN·Filed 2010·Granted May 29, 2012·41 cites·7 claims
- 2296US8110909B1Semiconductor package including top-surface terminals for mounting another semiconductor packageHINER DAVID JON·Filed 2010·Granted Feb 7, 2012·20 cites·16 claims
- 2396US7977163B1Embedded electronic component package fabrication methodAMKOR TECHNOLOGY INC·Filed 2009·Granted Jul 12, 2011·36 cites·18 claims
- 2496US7028400B1Integrated circuit substrate having laser-exposed terminalsAMKOR TECHNOLOGY INC·Filed 2003·Granted Apr 18, 2006·79 cites·20 claims
- 2595US10283400B1Semiconductor device package and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2018·Granted May 7, 2019·11 cites·20 claims
- 2695US8987050B1Method and system for backside dielectric patterning for wafer warpage and stress controlHINER DAVID JON·Filed 2012·Granted Mar 24, 2015·16 cites·26 claims
- 2795US8390130B1Through via recessed reveal structure and methodHINER DAVID JON·Filed 2011·Granted Mar 5, 2013·19 cites·17 claims
- 2895US7723210B2Direct-write wafer level chip scale packageAMKOR TECHNOLOGY INC·Filed 2007·Granted May 25, 2010·32 cites·14 claims
- 2994US11652038B2Semiconductor package with front side and back side redistribution structures and fabricating method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted May 16, 2023·2 cites·20 claims
- 3094US8501543B1Direct-write wafer level chip scale packageBERRY CHRISTOPHER JOHN·Filed 2012·Granted Aug 6, 2013·11 cites·20 claims
- 3194US8440554B1Through via connected backside embedded circuit features structure and methodHINER DAVID JON·Filed 2010·Granted May 14, 2013·17 cites·19 claims
- 3294US8220145B2Isolated conformal shieldingHINER DAVID J·Filed 2007·Granted Jul 17, 2012·25 cites·30 claims
- 3394US7365006B1Semiconductor package and substrate having multi-level vias fabrication methodAMKOR TECHNOLOGY INC·Filed 2006·Granted Apr 29, 2008·27 cites·20 claims
- 3493US10312220B2Semiconductor package and fabricating method thereofAMKOR TECHNOLOGY INC·Filed 2017·Granted Jun 4, 2019·12 cites·23 claims
- 3593US9048298B1Backside warpage control structure and fabrication methodHUEMOELLER RONALD PATRICK·Filed 2012·Granted Jun 2, 2015·15 cites·20 claims
- 3693US7589398B1Embedded metal features structureAMKOR TECHNOLOGY INC·Filed 2006·Granted Sep 15, 2009·26 cites·19 claims
- 3792US10943858B2Semiconductor package and fabricating method thereofAMKOR TECHNOLOGY INC·Filed 2019·Granted Mar 9, 2021·5 cites·20 claims
- 3892US9852976B2Semiconductor package and fabricating method thereofAMKOR TECHNOLOGY INC·Filed 2017·Granted Dec 26, 2017·6 cites·20 claims
- 3992US8324511B1Through via nub reveal method and structureHUEMOELLER RONALD PATRICK·Filed 2010·Granted Dec 4, 2012·15 cites·16 claims
- 4092US7190062B1Embedded leadframe semiconductor packageAMKOR TECHNOLOGY INC·Filed 2004·Granted Mar 13, 2007·73 cites·20 claims
- 4192US6930257B1Integrated circuit substrate having laminated laser-embedded circuit layersAMKOR TECHNOLOGY INC·Filed 2003·Granted Aug 16, 2005·62 cites·18 claims
- 4291US10714378B2Semiconductor device package and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2019·Granted Jul 14, 2020·5 cites·20 claims
- 4391US10672740B2Semiconductor package with high routing density patchAMKOR TECHNOLOGY INC·Filed 2018·Granted Jun 2, 2020·4 cites·13 claims
- 4491US8296941B2Conformal shielding employing segment buildupHINER DAVID J·Filed 2011·Granted Oct 30, 2012·10 cites·16 claims
- 4591US7670962B2Substrate having stiffener fabrication methodAMKOR TECHNOLOGY INC·Filed 2007·Granted Mar 2, 2010·19 cites·25 claims
- 4690US10497674B2Semiconductor package and fabricating method thereofAMKOR TECHNOLOGY INC·Filed 2018·Granted Dec 3, 2019·6 cites·26 claims
- 4790US9553041B1Semiconductor device package and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2016·Granted Jan 24, 2017·5 cites·20 claims
- 4890US2025096107A1Semiconductor package and fabricating method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Application pending·0 cites
- 4989US9818684B2Electronic device with a plurality of redistribution structures having different respective sizesAMKOR TECHNOLOGY INC·Filed 2016·Granted Nov 14, 2017·11 cites·22 claims
- 5089US9129943B1Embedded component package and fabrication methodHUEMOELLER RONALD PATRICK·Filed 2012·Granted Sep 8, 2015·9 cites·20 claims
Showing the top 50 of 95 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →