Inventor · disambiguated record
Dehong Ye
Also filed as: YE DEHONG
7 granted patents·4 pending applications·49 citations·filing 2008–2016
82Inventor score
Top patents by PatentIndex Score
11 records- 0190US8329509B2Packaging process to create wettable lead flank during board assemblyGONG ZHIWEI·Filed 2010·Granted Dec 11, 2012·21 cites·20 claims
- 0288US9406625B2Die edge seal employing low-K dielectric materialWANG ZHIJIE·Filed 2014·Granted Aug 2, 2016·14 cites·17 claims
- 0386US9362211B1Exposed pad integrated circuit package with mold lockFREESCALE SEMICONDUCTOR INC·Filed 2015·Granted Jun 7, 2016·7 cites·19 claims
- 0467US8288847B2Dual die semiconductor packageHuang meiquan·Filed 2010·Granted Oct 16, 2012·4 cites·11 claims
- 0566US8735223B2Semiconductor devices and methods of assembling sameGAO WEI·Filed 2012·Granted May 27, 2014·2 cites·15 claims
- 0657US7887928B2Coated lead frameFREESCALE SEMICONDUCTOR INC·Filed 2008·Granted Feb 15, 2011·1 cites·6 claims
- 0741US10283477B2Method of fabricating 3-dimensional fan-out structureNXP USA INC·Filed 2016·Granted May 7, 2019·0 cites·6 claims
- 0839US2015235969A1Backside metallization patterns for integrated circuitsZHANG HANMIN·Filed 2014·Application pending·0 cites
- 0937US2013020689A1Semiconductor device and method of packaging sameFREESCALE SEMICONDUCTOR INC·Filed 2012·Application pending·0 cites
- 1034US2012326288A1Method of assembling semiconductor deviceHuang meiquan·Filed 2012·Application pending·0 cites
- 1133US2011165729A1Method of packaging semiconductor deviceFREESCALE SEMICONDUCTOR INC·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →