Inventor · disambiguated record
Hui-Yen Huang
Also filed as: HUANG HUI · HUANG HUI Y · HUANG HUI-YEN
18 granted patents·8 pending applications·223 citations·filing 2004–2022
93Inventor score
Top patents by PatentIndex Score
26 records- 0193US7083302B2White light LED assemblyJ S TECHNOLOGY CO LTD·Filed 2004·Granted Aug 1, 2006·139 cites·8 claims
- 0288US8137999B2Package for a light emitting diode and method for fabricating the sameWANG BILY·Filed 2011·Granted Mar 20, 2012·8 cites·8 claims
- 0382US7671374B2LED chip package structure with a plurality of thick guiding pins and a method for manufacturing the sameHARVATEK CORP·Filed 2007·Granted Mar 2, 2010·9 cites·5 claims
- 0480US7080933B2BLU and module using the BLUJ S TECHNOLOGY CO LTD·Filed 2004·Granted Jul 25, 2006·25 cites·17 claims
- 0579US7211882B2LED package structure and method for making the sameHARVATEK CORP·Filed 2005·Granted May 1, 2007·8 cites·7 claims
- 0671US7803641B2Mold structure for packaging LED chips and method thereofHARVATEK CORP·Filed 2007·Granted Sep 28, 2010·5 cites·17 claims
- 0768US9981206B2Separator for oil well produced fluid, and separation device comprising the sameCHINA PETROLEUM & CHEM CORP·Filed 2016·Granted May 29, 2018·1 cites·21 claims
- 0862US7662661B2Method of manufacturing a substrate structure for increasing cutting precision and strength thereofHARVATEK CORP·Filed 2005·Granted Feb 16, 2010·1 cites·5 claims
- 0958USD509809SMetal base design for surface mount device LEDHARVATEK CORP·Filed 2004·Granted Sep 20, 2005·10 cites·1 claims
- 1055USD506187SMetal base design for surface mount device LED (light emitting diode)HARVATEK CORP·Filed 2004·Granted Jun 14, 2005·9 cites·1 claims
- 1154USD506732SLight-emitting diodeHARVATEK CORP·Filed 2004·Granted Jun 28, 2005·8 cites·1 claims
- 1253US7824938B2Method for manufacturing an LED chip package structureHARVATEK CORP·Filed 2009·Granted Nov 2, 2010·0 cites·12 claims
- 1353US2009239319A1Package for a light emitting diode and a process for fabricating the sameWANG BILY·Filed 2009·Application pending·0 cites
- 1452US12224221B2Packaging method and package structureHARVATEK CORP·Filed 2022·Granted Feb 11, 2025·0 cites·10 claims
- 1552US11699675B2Semiconductor device with high heat dissipation efficiencyHARVATEK CORP·Filed 2021·Granted Jul 11, 2023·0 cites·14 claims
- 1650US7303984B2Semiconductor substrate structure and processing method thereofHARVATEK CORP·Filed 2005·Granted Dec 4, 2007·0 cites·5 claims
- 1749US2007290220A1Package for a light emitting diode and a process for fabricating the sameWANG BILY·Filed 2006·Application pending·0 cites
- 1847US7842964B2Front and rear covering type LED package structure and method for packaging the sameHARVATEK CORP·Filed 2007·Granted Nov 30, 2010·0 cites·27 claims
- 1946US2006261455A1LED package structure and method making of the sameWANG BILY·Filed 2006·Application pending·0 cites
- 2045US2023215786A1Planar multi-chip deviceHARVATEK CORP·Filed 2022·Application pending·0 cites
- 2145US2023215785A1Vertical type multi-chip deviceHARVATEK CORP·Filed 2022·Application pending·0 cites
- 2244US2006035406A1Method of forming a composite polymer material inside trenches of a semiconductor substrate to form a composite polymer structureHARVATEK CORP·Filed 2004·Application pending·0 cites
- 2341US2005157500A1Illumination apparatus with laser emitting diodeFiled 2004·Application pending·0 cites
- 2436US9887179B2Light emitting diode device and light emitting device using the sameHARVATEK CORP·Filed 2015·Granted Feb 6, 2018·0 cites·11 claims
- 2536US2005157515A1Light emitting diode light sourceFiled 2004·Application pending·0 cites
- 2633US10084123B2Portable light-emitting device without pre-stored power sources and LED package structure thereofHARVATEK CORP·Filed 2016·Granted Sep 25, 2018·0 cites·17 claims
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