Inventor · disambiguated record
Fayaz Shaikh
Also filed as: SHAIKH FAYAZ A · Shaikh Fayaz
15 granted patents·13 pending applications·58 citations·filing 2015–2024
91Inventor score
Files withLAM RES CORP28
Top patents by PatentIndex Score
28 records- 0197US11725283B2PECVD deposition system for deposition on selective side of the substrateLAM RES CORP·Filed 2021·Granted Aug 15, 2023·5 cites·13 claims
- 0297US11441222B2PECVD deposition system for deposition on selective side of the substrateLAM RES CORP·Filed 2021·Granted Sep 13, 2022·7 cites·20 claims
- 0396US10851457B2PECVD deposition system for deposition on selective side of the substrateLAM RES CORP·Filed 2017·Granted Dec 1, 2020·14 cites·13 claims
- 0495US11946142B2Spatially tunable deposition to compensate within wafer differential bowLAM RES CORP·Filed 2020·Granted Apr 2, 2024·4 cites·20 claims
- 0590US11851760B2PECVD deposition system for deposition on selective side of the substrateLAM RES CORP·Filed 2021·Granted Dec 26, 2023·1 cites·11 claims
- 0690US10096475B1System and method for depositing a homogenous interface for PECVD metal-doped carbon hardmasksLAM RES CORP·Filed 2017·Granted Oct 9, 2018·6 cites·17 claims
- 0789US11674226B2Separation of plasma suppression and wafer edge to improve edge film thickness uniformityLAM RES CORP·Filed 2020·Granted Jun 13, 2023·2 cites·17 claims
- 0888US9859088B2Inter-electrode gap variation methods for compensating deposition non-uniformityLAM RES CORP·Filed 2015·Granted Jan 2, 2018·5 cites·10 claims
- 0988US9520295B2Metal doping of amorphous carbon and silicon films used as hardmasks in substrate processing systemsLAM RES CORP·Filed 2015·Granted Dec 13, 2016·6 cites·36 claims
- 1086US2024309507A1Pecvd deposition system for deposition on selective side of the substrateLAM RES CORP·Filed 2024·Application pending·0 cites
- 1185US10388485B2Inter-electrode gap variation methods for compensating deposition non-uniformityLAM RES CORP·Filed 2018·Granted Aug 20, 2019·3 cites·16 claims
- 1281US9928994B2Methods for decreasing carbon-hydrogen content of amorphous carbon hardmask filmsLAM RES CORP·Filed 2015·Granted Mar 27, 2018·3 cites·4 claims
- 1378US10903070B2Asymmetric wafer bow compensation by chemical vapor depositionLAM RES CORP·Filed 2018·Granted Jan 26, 2021·2 cites·19 claims
- 1473US12338531B2Spatially tunable deposition to compensate within wafer differential bowLAM RES CORP·Filed 2024·Granted Jun 24, 2025·0 cites·20 claims
- 1573US2021108314A1Methods for Depositing a Film on a Backside of a SubstrateLAM RES CORP·Filed 2020·Application pending·0 cites
- 1672US2023323535A1Separation of plasma suppression and wafer edge to improve edge film thickness uniformityLAM RES CORP·Filed 2023·Application pending·0 cites
- 1753US12300489B2UV cure for local stress modulationLAM RES CORP·Filed 2021·Granted May 13, 2025·0 cites·20 claims
- 1853US2025118592A1Apparatuses for backside wafer processing with edge-only wafer contactLAM RES CORP·Filed 2023·Application pending·0 cites
- 1951US2022199379A1High temperature heating of a substrate in a processing chamberLAM RES CORP·Filed 2020·Application pending·0 cites
- 2051US2017002465A1Separation of Plasma Suppression and Wafer Edge to Improve Edge Film Thickness UniformityLAM RES CORP·Filed 2015·Application pending·0 cites
- 2150US2025283221A1Carrier ring with tabsLAM RES CORP·Filed 2023·Application pending·0 cites
- 2249US2025385088A1Backside layer for a semiconductor substrateLAM RES CORP·Filed 2023·Application pending·0 cites
- 2348US2023238223A1Carrier rings with radially-varied plasma impedanceLAM RES CORP·Filed 2021·Application pending·0 cites
- 2448US2023352279A1Multi-station processing tools with station-varying support features for backside processingLAM RES CORP·Filed 2021·Application pending·0 cites
- 2545US2025037992A1Deposition of high compressive stress thermally stable nitride filmLAM RES CORP·Filed 2022·Application pending·0 cites
- 2643US9875890B2Deposition of metal dielectric film for hardmasksLAM RES CORP·Filed 2015·Granted Jan 23, 2018·0 cites·27 claims
- 2742US2023136819A1Control of wafer bow during integrated circuit processingLAM RES CORP·Filed 2021·Application pending·0 cites
- 2833US2016289827A1Plasma processing systems and structures having sloped confinement ringsLAM RES CORP·Filed 2015·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Fayaz Shaikh files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →