Inventor · disambiguated record
Kei Hayasaki
Also filed as: HAYASAKI KEI
33 granted patents·5 pending applications·275 citations·filing 1998–2011
97Inventor score
Top patents by PatentIndex Score
38 records- 0188US7327436B2Method for evaluating a local flare, correction method for a mask pattern, manufacturing method for a semiconductor device and a computer program productTOSHIBA KK·Filed 2005·Granted Feb 5, 2008·12 cites·20 claims
- 0284US7483155B2Structure inspection method, pattern formation method, process condition determination method and resist pattern evaluation apparatusTOSHIBA KK·Filed 2005·Granted Jan 27, 2009·6 cites·10 claims
- 0381US6441351B2Heating device, method for evaluating heating device and pattern forming methodTOSHIBA KK·Filed 2000·Granted Aug 27, 2002·17 cites·14 claims
- 0477US6881058B2Apparatus for processing substrate and method of processing the sameTOSHIBA KK·Filed 2001·Granted Apr 19, 2005·14 cites·25 claims
- 0576US6800569B2Film forming method, film forming apparatus, pattern forming method, and manufacturing method of semiconductor apparatusTOSHIBA KK·Filed 2003·Granted Oct 5, 2004·12 cites·13 claims
- 0675US6742944B2Alkaline solution and manufacturing method, and alkaline solution applied to pattern forming method, resist film removing method, solution application method, substrate treatment method, solution supply method, and semiconductor device manufacturing methodTOSHIBA KK·Filed 2002·Granted Jun 1, 2004·13 cites·12 claims
- 0774US7510341B2Temperature calibration method for baking processing apparatus, adjustment method for development processing apparatus, and method of manufacturing semiconductor apparatusTOSHIBA KK·Filed 2004·Granted Mar 31, 2009·14 cites·32 claims
- 0874US7399578B2Alkaline solution and manufacturing method, and alkaline solution applied to pattern forming method, resist film removing method, solution application method, substrate treatment method, solution supply method, and semiconductor device manufacturing methodTOSHIBA KK·Filed 2006·Granted Jul 15, 2008·3 cites·5 claims
- 0974US7018481B2Substrate treating method, substrate-processing apparatus, developing method, method of manufacturing a semiconductor device, and method of cleaning a developing solution nozzleTOSHIBA KK·Filed 2003·Granted Mar 28, 2006·13 cites·12 claims
- 1074US6603101B2Heating device, method for evaluating heating device and pattern forming methodTOSHIBA KK·Filed 2002·Granted Aug 5, 2003·11 cites·14 claims
- 1174US6187488B1Pattern estimating method and pattern forming methodTOSHIBA KK·Filed 2000·Granted Feb 13, 2001·13 cites·20 claims
- 1273US6191397B1Heating device, method for evaluating heating device and pattern forming methodTOSHIBA KK·Filed 1999·Granted Feb 20, 2001·29 cites·9 claims
- 1372US6423977B1Pattern size evaluation apparatusTOSHIBA KK·Filed 1998·Granted Jul 23, 2002·37 cites·13 claims
- 1471US7662546B2Apparatus for processing substrate and method of processing the sameTOSHIBA KK·Filed 2005·Granted Feb 16, 2010·2 cites·19 claims
- 1571US7364839B2Method for forming a pattern and substrate-processing apparatusTOSHIBA KK·Filed 2003·Granted Apr 29, 2008·10 cites·32 claims
- 1671US7005249B2Apparatus for processing substrate and method of processing the sameTOSHIBA KK·Filed 2005·Granted Feb 28, 2006·2 cites·8 claims
- 1771US6686130B2Pattern forming method using photolithographyTOSHIBA KK·Filed 2001·Granted Feb 3, 2004·11 cites·23 claims
- 1870US7563561B2Pattern forming method and a semiconductor device manufacturing methodTOSHIBA KK·Filed 2005·Granted Jul 21, 2009·2 cites·20 claims
- 1967US7604832B2Film forming method, film forming apparatus, pattern forming method, and manufacturing method of semiconductor apparatusTOSHIBA KK·Filed 2004·Granted Oct 20, 2009·7 cites·5 claims
- 2067US6251544B1Exposure dose measuring method and exposure dose measuring maskTOSHIBA KK·Filed 1999·Granted Jun 26, 2001·25 cites·17 claims
- 2165US7972765B2Pattern forming method and a semiconductor device manufacturing methodTOSHIBA KK·Filed 2009·Granted Jul 5, 2011·1 cites·3 claims
- 2265US7312018B2Film forming method, film forming apparatus, pattern forming method, and manufacturing method of semiconductor apparatusTOSHIBA KK·Filed 2004·Granted Dec 25, 2007·6 cites·7 claims
- 2363US7794923B2Substrate processing method, substrate processing apparatus, and manufacturing method of semiconductor deviceTOSHIBA KK·Filed 2007·Granted Sep 14, 2010·1 cites·18 claims
- 2459US6831258B2Heating device, method for evaluating heating device and pattern forming methodTOSHIBA KK·Filed 2003·Granted Dec 14, 2004·4 cites·4 claims
- 2558US2010104988A1Substrate treating method, substrate-processing apparatus, developing method, method of manufacturing a semiconductor device, and method of cleaning a developing solution nozzleTOSHIBA KK·Filed 2009·Application pending·0 cites
- 2657US8071157B2Film forming method, film forming apparatus, pattern forming method, and manufacturing method of semiconductor apparatusITO SHINICHI·Filed 2007·Granted Dec 6, 2011·0 cites·10 claims
- 2757US7669608B2Substrate treating method, substrate-processing apparatus, developing method, method of manufacturing a semiconductor device, and method of cleaning a developing solution nozzleTOSHIBA KK·Filed 2004·Granted Mar 2, 2010·4 cites·12 claims
- 2856US7903264B2Structure inspection method, pattern formation method, process condition determination method and resist pattern evaluation apparatusTOSHIBA KK·Filed 2008·Granted Mar 8, 2011·0 cites·37 claims
- 2954US7368209B2Method for evaluating sensitivity of photoresist, method for preparation of photoresist and manufacturing method of semiconductor deviceTOSHIBA KK·Filed 2004·Granted May 6, 2008·3 cites·28 claims
- 3052US7968272B2Semiconductor device manufacturing method to form resist patternTOSHIBA KK·Filed 2006·Granted Jun 28, 2011·0 cites·4 claims
- 3152US7005238B2Apparatus for processing substrate and method of processing the sameTOSHIBA KK·Filed 2005·Granted Feb 28, 2006·0 cites·20 claims
- 3252US2011008545A1Film forming method, film forming apparatus, pattern forming method, and manufacturing method of semiconductor apparatusTOSHIBA KK·Filed 2010·Application pending·0 cites
- 3350US2011229826A1Semiconductor device manufacturing method to form resist pattern, and substrate processing apparatusKAWAMURA DAISUKE·Filed 2011·Application pending·0 cites
- 3449US6818387B2Method of forming a patternTOSHIBA KK·Filed 2002·Granted Nov 16, 2004·2 cites·15 claims
- 3548US7097960B2Alkaline solution and manufacturing method, and alkaline solution applied to pattern forming method, resist film removing method, solution application method, substrate treatment method, solution supply method, and semiconductor device manufacturing methodTOSHIBA KK·Filed 2004·Granted Aug 29, 2006·1 cites·6 claims
- 3645US7683291B2Substrate processing method and manufacturing method of semiconductor deviceTOSHIBA KK·Filed 2006·Granted Mar 23, 2010·0 cites·18 claims
- 3745US2008003837A1Substrate processing method and semiconductor device manufacturing method carried out in a lithographic processHAYASAKI KEI·Filed 2007·Application pending·0 cites
- 3845US2007199579A1Substrate treatment method, substrate treatment apparatus, and semiconductor device manufacturing methodHAYASAKI KEI·Filed 2007·Application pending·0 cites
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