Inventor · disambiguated record
Seiji Shika
Also filed as: SHIKA SEIJI
10 granted patents·1 pending application·44 citations·filing 2004–2020
81Inventor score
Top patents by PatentIndex Score
11 records- 0192US11680139B2Resin composition, resin sheet, multilayer printed wiring board, and semiconductor deviceMITSUBISHI GAS CHEMICAL CO·Filed 2020·Granted Jun 20, 2023·4 cites·2 claims
- 0283US11466123B2Resin composition, resin sheet, multilayer printed wiring board, and semiconductor deviceMITSUBISHI GAS CHEMICAL CO·Filed 2020·Granted Oct 11, 2022·2 cites·7 claims
- 0376US7192651B2Resin composition and prepreg for laminate and metal-clad laminateMITSUBISHI GAS CHEMICAL CO·Filed 2004·Granted Mar 20, 2007·38 cites·5 claims
- 0466US11767287B2Compound and method for producing the same, resin composition, resin sheet, multilayer printed wiring board, and semiconductor deviceMITSUBISHI GAS CHEMICAL CO·Filed 2020·Granted Sep 26, 2023·0 cites·13 claims
- 0561US12312323B2Compound, method for producing same, resin composition, resin sheet, multilayer printed wiring board, and semiconductor deviceMITSUBISHI GAS CHEMICAL CO·Filed 2020·Granted May 27, 2025·0 cites·13 claims
- 0658US11643493B2Resin composition, resin sheet, multilayer printed wiring board, and semiconductor deviceMITSUBISHI GAS CHEMICAL CO·Filed 2020·Granted May 9, 2023·0 cites·7 claims
- 0749US11370857B2Resin composition, resin sheet, multilayer printed wiring board, and semiconductor deviceMITSUBISHI GAS CHEMICAL CO·Filed 2019·Granted Jun 28, 2022·0 cites·6 claims
- 0846US11447658B2Resin composition, resin sheet, multilayer printed wiring board, and semiconductor deviceMITSUBISHI GAS CHEMICAL CO·Filed 2020·Granted Sep 20, 2022·0 cites·8 claims
- 0943US2015034369A1Resin composition for printed wiring boardsKASHIMA NAOKI·Filed 2012·Application pending·0 cites
- 1042US12133339B2Resin composition, resin sheet, multilayer printed wiring board, and semiconductor deviceMITSUBISHI GAS CHEMICAL CO·Filed 2020·Granted Oct 29, 2024·0 cites·8 claims
- 1139US9351397B2Resin composition for printed wiring board material, and prepreg, resin sheet, metal foil clad laminate, and printed wiring board using sameMITSUBISHI GAS CHEMICAL CO·Filed 2013·Granted May 24, 2016·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →