Inventor · disambiguated record
Zhitao Cao
Also filed as: CAO ZHITAO
8 granted patents·5 pending applications·22 citations·filing 2011–2024
81Inventor score
Top patents by PatentIndex Score
13 records- 0198US11309246B2High density 3D interconnect configurationAPPLE INC·Filed 2020·Granted Apr 19, 2022·10 cites·20 claims
- 0292US12119304B2Very fine pitch and wiring density organic side by side chiplet integrationAPPLE INC·Filed 2021·Granted Oct 15, 2024·2 cites·28 claims
- 0390US11735526B2High density 3D interconnect configurationAPPLE INC·Filed 2022·Granted Aug 22, 2023·1 cites·20 claims
- 0490US10102962B1Integrated magnetic passive devices using magnetic filmAPPLE INC·Filed 2016·Granted Oct 16, 2018·7 cites·13 claims
- 0584US2025046715A1High Density 3D Interconnect ConfigurationAPPLE INC·Filed 2024·Application pending·0 cites
- 0680US12159835B2High density 3D interconnect configurationAPPLE INC·Filed 2023·Granted Dec 3, 2024·0 cites·17 claims
- 0775US2025062236A1Very Fine Pitch and Wiring Density Organic Side by Side Chiplet IntegrationAPPLE INC·Filed 2024·Application pending·0 cites
- 0863US2019051449A1Integrated magnetic passive devices using magnetic filmAPPLE INC·Filed 2018·Application pending·0 cites
- 0958US9960023B2Methods and apparatus for nodule control in a titanium-tungsten targetAPPLIED MATERIALS INC·Filed 2014·Granted May 1, 2018·0 cites·16 claims
- 1058US8835308B2Methods for depositing materials in high aspect ratio featuresCAO ZHITAO·Filed 2011·Granted Sep 16, 2014·2 cites·15 claims
- 1155US2024105626A1Semiconductor Package with Local Interconnect and Chiplet IntegrationAPPLE INC·Filed 2023·Application pending·0 cites
- 1242US10115573B2Apparatus for high compressive stress film deposition to improve kit lifeAPPLIED MATERIALS INC·Filed 2015·Granted Oct 30, 2018·0 cites·20 claims
- 1331US2012058281A1Methods for forming low moisture dielectric filmsHUA ZHONG QIANG·Filed 2011·Application pending·0 cites
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