Inventor · disambiguated record
Vladimir Noveski
Also filed as: NOVESKI VLADIMIR
10 granted patents·5 pending applications·78 citations·filing 2006–2024
87Inventor score
Top patents by PatentIndex Score
15 records- 0195US7678195B2Seeded growth process for preparing aluminum nitride single crystalsUNIV NORTH CAROLINA STATE·Filed 2006·Granted Mar 16, 2010·46 cites·11 claims
- 0291US9806063B2Reinforced wafer level package comprising a core layer for reducing stress in a solder joint and improving solder joint reliabilityQUALCOMM INC·Filed 2015·Granted Oct 31, 2017·9 cites·23 claims
- 0388US7632454B2Dense, shaped articles constructed of a refractory material and methods of preparing such articlesUNIV NORTH CAROLINA STATE·Filed 2006·Granted Dec 15, 2009·12 cites·23 claims
- 0477US8174084B2Stress sensor for in-situ measurement of package-induced stress in semiconductor devicesFARAHANI MOHAMMAD M·Filed 2006·Granted May 8, 2012·5 cites·10 claims
- 0576US8586393B2Stress sensor for in-situ measurement of package-induced stress in semiconductor devicesFARAHANI MOHAMMAD M·Filed 2012·Granted Nov 19, 2013·3 cites·15 claims
- 0666US8414677B2Dense, shaped articles constructed of a refractory material and methods of preparing such articlesSCHLESSER RAOUL·Filed 2009·Granted Apr 9, 2013·2 cites·17 claims
- 0761US2025191993A1Semiconductor device assembly with thermally-conductive filler in an inter-die gapMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 0859US8186051B2Method for fabricating package substrate and die spacer layers having a ceramic backboneALEKSOV ALEKSANDAR·Filed 2008·Granted May 29, 2012·1 cites·5 claims
- 0955US9258880B2Package substrate and die spacer layers having a ceramic backboneINTEL CORP·Filed 2013·Granted Feb 9, 2016·0 cites·18 claims
- 1051US8604353B2Package substrate and die spacer layers having a ceramic backboneALEKSOV ALEKSANDAR·Filed 2012·Granted Dec 10, 2013·0 cites·16 claims
- 1150US2014013855A1Deflection sensor for in-situ deflection measurement in semiconductor devicesFARAHANI MOHAMMAD M·Filed 2013·Application pending·0 cites
- 1243US2008237844A1Microelectronic package and method of manufacturing sameALEKSOV ALEKSANDAR·Filed 2007·Application pending·0 cites
- 1340US2008237718A1Methods of forming highly oriented diamond films and structures formed therebyNOVESKI VLADIMIR·Filed 2007·Application pending·0 cites
- 1439US10037941B2Integrated device package comprising photo sensitive fill between a substrate and a dieQUALCOMM INC·Filed 2015·Granted Jul 31, 2018·0 cites·19 claims
- 1533US2016148864A1Integrated device package comprising heterogeneous solder joint structureQUALCOMM INC·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →