Inventor · disambiguated record
Yuji Fukazawa
Also filed as: FUKAZAWA YUJI
18 granted patents·1 pending application·588 citations·filing 1993–2004
96Inventor score
Top patents by PatentIndex Score
19 records- 0185US5511587AWear-resistant reed for a high-speed loomCITIZEN WATCH CO LTD·Filed 1995·Granted Apr 30, 1996·43 cites·19 claims
- 0284US5810940AMethod for cleaning semiconductor wafersTOSHIBA KK·Filed 1996·Granted Sep 22, 1998·81 cites·28 claims
- 0381US5571367AApparatus for subjecting a semiconductor substrate to a washing processTOSHIBA KK·Filed 1995·Granted Nov 5, 1996·70 cites·7 claims
- 0480US5470393ASemiconductor wafer treating methodTOSHIBA KK·Filed 1994·Granted Nov 28, 1995·70 cites·15 claims
- 0578US5442236ASemiconductor device having a multilayered wiring structure with dummy wiringTOSHIBA KK·Filed 1995·Granted Aug 15, 1995·55 cites·8 claims
- 0677US6423146B1Method for cleaning a semiconductor substrateTOSHIBA KK·Filed 1997·Granted Jul 23, 2002·52 cites·8 claims
- 0773US5346949AFluorine containing aqueous composition having water repellent and oil repellent propertiesHOECHST GOSEI KK·Filed 1993·Granted Sep 13, 1994·28 cites·8 claims
- 0870US5985469AWhite decorative part and process for producing the sameCITIZEN WATCH CO LTD·Filed 1997·Granted Nov 16, 1999·34 cites·9 claims
- 0970US5527707AMethod of analyzing impurities in the surface of a semiconductor waferTOSHIBA KK·Filed 1994·Granted Jun 18, 1996·32 cites·4 claims
- 1068US5868855ASurface processing method and surface processing device for silicon substratesKABUSHKI KAISHA TOSHIBA·Filed 1996·Granted Feb 9, 1999·34 cites·10 claims
- 1163US6152153ASubstrate cleaning/drying equipment and substrate cleaning/drying methodTOSHIBA KK·Filed 1998·Granted Nov 28, 2000·28 cites·13 claims
- 1262US6291300B1Manufacturing method of semiconductor devicesTOSHIBA KK·Filed 2000·Granted Sep 18, 2001·10 cites·3 claims
- 1360US5744402AMethod of manufacturing semiconductor devicesTOSHIBA KK·Filed 1995·Granted Apr 28, 1998·26 cites·23 claims
- 1455US7208831B2Semiconductor device having multilayer wiring structure and method, wherein connecting portion and wiring layer are formed of same layerTOSHIBA KK·Filed 2004·Granted Apr 24, 2007·5 cites·12 claims
- 1553US6759314B1Method for manufacturing semiconductor devices using thermal nitride films as gate insulating filmsTOSHIBA KK·Filed 2000·Granted Jul 6, 2004·5 cites·15 claims
- 1642US5643404AMethod for examination of silicon wafer surface defectsPUREX CO LTD·Filed 1995·Granted Jul 1, 1997·9 cites·9 claims
- 1739US6693028B2Semiconductor device having multilayer wiring structure and method for manufacturing the sameTOSHIBA KK·Filed 2001·Granted Feb 17, 2004·0 cites·3 claims
- 1838US5786570AHeating roller deviceCITIZEN WATCH CO LTD·Filed 1997·Granted Jul 28, 1998·6 cites·5 claims
- 1937US2001034107A1Manufacturing method of semiconductor devicesTOSHIBA KK·Filed 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →