Inventor · disambiguated record
Jung Hwan Chun
Also filed as: CHUN JUNG HWAN
12 granted patents·2 pending applications·30 citations·filing 2001–2023
86Inventor score
Top patents by PatentIndex Score
14 records- 0185US8912662B2Wafer-level package and method of manufacturing the sameSTS SC & TELECOMM CO LTD·Filed 2013·Granted Dec 16, 2014·9 cites·7 claims
- 0279US11114544B2Integrated circuit device having fin-type activeSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Sep 7, 2021·2 cites·18 claims
- 0375US11955531B2Method of forming an integrated circuit device having a contact capping layerSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Apr 9, 2024·0 cites·20 claims
- 0475US8952514B2Semiconductor packageCHUN JUNG HWAN·Filed 2012·Granted Feb 10, 2015·5 cites·11 claims
- 0569US11626503B2Integrated circuit device having fin-type activeSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Apr 11, 2023·0 cites·20 claims
- 0666US8222120B2Method of dicing wafer using plasmaCHUN JUNG HWAN·Filed 2009·Granted Jul 17, 2012·4 cites·15 claims
- 0761US6608380B2Semiconductor chip package having one or more sealing screwsSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Aug 19, 2003·10 cites·15 claims
- 0854US12279449B2Semiconductor devices having upper and lower active contactsSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Apr 15, 2025·0 cites·18 claims
- 0953US12490481B2Semiconductor devices and methods for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 2, 2025·0 cites·19 claims
- 1050US2023411498A1Method for fabricating semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1148US2023395667A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1242US8785254B2Method of manufacturing high-capacity semiconductor packageSTS SC & TELECOMM CO LTD·Filed 2013·Granted Jul 22, 2014·0 cites·10 claims
- 1340US8202744B2Wafer through silicon via forming method and equipment thereforCHUN JUNG HWAN·Filed 2009·Granted Jun 19, 2012·0 cites·11 claims
- 1439US9024452B2Semiconductor package comprising an interposer and method of manufacturing the sameCHUN JUNG HWAN·Filed 2012·Granted May 5, 2015·0 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →