Inventor · disambiguated record
Yongbo Yang
Also filed as: YANG YONGBO
4 granted patents·2 pending applications·6 citations·filing 2013–2024
66Inventor score
Files withUTAC HEADQUARTERS PTE LTD3CHONGQING XISHAN SCIENCE & TECH CO LTD1HARBIN WELDING INST CO LTD1UNITED TEST & ASSEMBLY CT LT1
Top patents by PatentIndex Score
6 records- 0180US9786625B2Semiconductor packages and methods of packaging semiconductor devicesUTAC HEADQUARTERS PTE LTD·Filed 2015·Granted Oct 10, 2017·3 cites·20 claims
- 0276US9087777B2Semiconductor packages and methods of packaging semiconductor devicesUNITED TEST & ASSEMBLY CT LT·Filed 2013·Granted Jul 21, 2015·3 cites·22 claims
- 0358US2019348387A1Semiconductor packages and methods of packaging semiconductor devicesUTAC HEADQUARTERS PTE LTD·Filed 2019·Application pending·0 cites
- 0457US12472577B2Lateral electro-conduction device and method for multi-wire submerged arc inner/outer welding of straight-seam steel pipeHARBIN WELDING INST CO LTD·Filed 2024·Granted Nov 18, 2025·0 cites·7 claims
- 0555US10403592B2Semiconductor packages and methods of packaging semiconductor devicesUTAC HEADQUARTERS PTE LTD·Filed 2017·Granted Sep 3, 2019·0 cites·20 claims
- 0634US2020015794A1Rotary Cutting Tool And Rotary Cutting Operating AssemblyCHONGQING XISHAN SCIENCE & TECH CO LTD·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →