Inventor · disambiguated record
Wun-Kai Tsai
Also filed as: TSAI WUN-KAI
6 granted patents·1 pending application·7 citations·filing 2011–2024
74Inventor score
Technology areasH10P
Top patents by PatentIndex Score
7 records- 0179US9123754B2Bonding alignment tool and methodSHIH YUN-TAI·Filed 2011·Granted Sep 1, 2015·6 cites·20 claims
- 0275US2024363318A1Arcing protection method, processing tool and fabrication systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0374US12057301B2Arcing protection method, processing tool and fabrication systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 6, 2024·0 cites·20 claims
- 0470US11664206B2Arcing protection method and processing toolTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 30, 2023·1 cites·20 claims
- 0569US11721662B2Wafer bonding method and wafer bonding apparatusTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 8, 2023·0 cites·20 claims
- 0662US10847490B2Bonding alignment toolTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 24, 2020·0 cites·20 claims
- 0751US10396054B2Bonding alignment toolTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 27, 2019·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →