Inventor · disambiguated record
James P. Letterman, Jr.
Also filed as: LETTERMAN JAMES P · LETTERMAN JR JAMES P · LETTERMAN JR JAMES PRICE
39 granted patents·2 pending applications·359 citations·filing 1992–2019
97Inventor score
Files withSEMICONDUCTOR COMPONENTS IND22SEMICONDUCTOR COMPONENTS IND LLC12MOTOROLA INC3CELAYA PHILLIP2CARNEY FRANCIS J1
Top patents by PatentIndex Score
41 records- 0192US6164523AElectronic component and method of manufactureSEMICONDUCTOR COMPONENTS IND·Filed 1998·Granted Dec 26, 2000·137 cites·9 claims
- 0289US10269609B2Wafer level flat no-lead semiconductor packages and methods of manufactureSEMICONDUCTOR COMPONENTS IND LLC·Filed 2018·Granted Apr 23, 2019·4 cites·16 claims
- 0389US9899349B2Semiconductor packages and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2016·Granted Feb 20, 2018·6 cites·15 claims
- 0488US8071427B2Method for manufacturing a semiconductor component and structure thereforCELAYA PHILLIP·Filed 2009·Granted Dec 6, 2011·18 cites·14 claims
- 0587US10304798B2Semiconductor packages with leadframes and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2018·Granted May 28, 2019·4 cites·13 claims
- 0683US10163766B2Methods of forming leadless semiconductor packages with plated leadframes and wettable flanksSEMICONDUCTOR COMPONENTS IND LLC·Filed 2016·Granted Dec 25, 2018·3 cites·19 claims
- 0783US7439100B2Encapsulated chip scale package having flip-chip on lead frame structure and methodSEMICONDUCTOR COMPONENTS IND·Filed 2005·Granted Oct 21, 2008·13 cites·19 claims
- 0877US10103072B2Damaging components with defective electrical couplingsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2016·Granted Oct 16, 2018·2 cites·17 claims
- 0976US7656048B2Encapsulated chip scale package having flip-chip on lead frame structureSEMICONDUCTOR COMPONENTS IND·Filed 2008·Granted Feb 2, 2010·7 cites·20 claims
- 1074US7901990B2Method of forming a molded array package device having an exposed tab and structureSEMICONDUCTOR COMPONENTS IND·Filed 2009·Granted Mar 8, 2011·5 cites·11 claims
- 1174US6768186B2Semiconductor device and laminated leadframe packageSEMICONDUCTOR COMPONENTS IND·Filed 2002·Granted Jul 27, 2004·20 cites·21 claims
- 1270US7588999B2Method of forming a leaded molded array packageSEMICONDUCTOR COMPONENTS IND·Filed 2005·Granted Sep 15, 2009·4 cites·14 claims
- 1368US7638863B2Semiconductor package and method thereforSEMICONDUCTOR COMPONENTS IND·Filed 2006·Granted Dec 29, 2009·3 cites·14 claims
- 1468US7202105B2Multi-chip semiconductor connector assembly methodSEMICONDUCTOR COMPONENTS IND·Filed 2004·Granted Apr 10, 2007·12 cites·20 claims
- 1567US7298034B2Multi-chip semiconductor connector assembliesSEMICONDUCTOR COMPONENTS IND·Filed 2004·Granted Nov 20, 2007·12 cites·6 claims
- 1667US6081031ASemiconductor package consisting of multiple conductive layersSEMICONDUCTOR COMPONENTS IND·Filed 1998·Granted Jun 27, 2000·27 cites·20 claims
- 1765US7875964B2Multi-chip semiconductor connector and methodSEMICONDUCTOR COMPONENTS IND·Filed 2007·Granted Jan 25, 2011·2 cites·9 claims
- 1863US7602054B2Method of forming a molded array package device having an exposed tab and structureSEMICONDUCTOR COMPONENTS IND·Filed 2005·Granted Oct 13, 2009·2 cites·16 claims
- 1962US10770332B2Wafer level flat no-lead semiconductor packages and methods of manufactureSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted Sep 8, 2020·0 cites·20 claims
- 2062US10770333B2Wafer level flat no-lead semiconductor packages and methods of manufactureSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted Sep 8, 2020·0 cites·20 claims
- 2162US10707111B2Wafer level flat no-lead semiconductor packages and methods of manufactureSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted Jul 7, 2020·0 cites·20 claims
- 2261US7508060B2Multi-chip semiconductor connector assembliesSEMICONDUCTOR COMPONENTS IND·Filed 2007·Granted Mar 24, 2009·2 cites·13 claims
- 2360US11049843B2Semiconductor packagesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted Jun 29, 2021·0 cites·20 claims
- 2460US8324026B2Method for manufacturing a semiconductor componentCELAYA PHILLIP·Filed 2011·Granted Dec 4, 2012·1 cites·15 claims
- 2560US5886400ASemiconductor device having an insulating layer and method for makingMOTOROLA INC·Filed 1997·Granted Mar 23, 1999·26 cites·26 claims
- 2658US9892952B2Wafer level flat no-lead semiconductor packages and methods of manufactureSEMICONDUCTOR COMPONENTS IND LLC·Filed 2014·Granted Feb 13, 2018·0 cites·7 claims
- 2757US11145581B2Methods of forming leadless semiconductor packages with plated leadframes and wettable flanksSEMICONDUCTOR COMPONENTS IND LLC·Filed 2018·Granted Oct 12, 2021·0 cites·8 claims
- 2857US10529632B2Damaging components with defective electrical couplingsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2018·Granted Jan 7, 2020·0 cites·20 claims
- 2957US8319323B2Electronic package having down-set leads and methodLETTERMAN JR JAMES P·Filed 2004·Granted Nov 27, 2012·10 cites·21 claims
- 3055US7825505B2Semiconductor package and method thereforSEMICONDUCTOR COMPONENTS IND·Filed 2009·Granted Nov 2, 2010·0 cites·9 claims
- 3153US7820528B2Method of forming a leaded molded array packageSEMICONDUCTOR COMPONENTS IND·Filed 2009·Granted Oct 26, 2010·0 cites·17 claims
- 3253US5785791AMethod of manufacturing semiconductor componentMOTOROLA INC·Filed 1997·Granted Jul 28, 1998·19 cites·19 claims
- 3351US7202106B2Multi-chip semiconductor connector and methodSEMICONDUCTOR COMPONENTS IND·Filed 2004·Granted Apr 10, 2007·3 cites·14 claims
- 3449US7498195B2Multi-chip semiconductor connector assembly methodSEMICONDUCTOR COMPONENTS IND·Filed 2007·Granted Mar 3, 2009·0 cites·8 claims
- 3547US5309027AEncapsulated semiconductor package having protectant circular insulatorsMOTOROLA INC·Filed 1992·Granted May 3, 1994·16 cites·14 claims
- 3646US7598123B2Semiconductor component and method of manufactureSEMICONDUCTOR COMPONENTS IND·Filed 2007·Granted Oct 6, 2009·0 cites·20 claims
- 3744US8253239B2Multi-chip semiconductor connectorCARNEY FRANCIS J·Filed 2010·Granted Aug 28, 2012·0 cites·4 claims
- 3842US2015035166A1Method for manufacturing a semiconductor component and structureSEMICONDUCTOR COMPONENTS IND·Filed 2014·Application pending·0 cites
- 3940US2014151883A1Method for manufacturing a semiconductor component and structure thereforSEMICONDUCTOR COMPONENTS IND·Filed 2012·Application pending·0 cites
- 4039US6376266B1Semiconductor package and method for forming sameSEMICONDUCTOR COMPONENTS IND·Filed 2000·Granted Apr 23, 2002·1 cites·16 claims
- 4138US7109064B2Method of forming a semiconductor package and leadframe thereforSEMICONDUCTOR COMPONENTS IND·Filed 2003·Granted Sep 19, 2006·0 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →