Inventor · disambiguated record
Joseph K. Fauty
Also filed as: FAUTY JOSEPH K
19 granted patents·1 pending application·256 citations·filing 1998–2010
94Inventor score
Top patents by PatentIndex Score
20 records- 0192US6164523AElectronic component and method of manufactureSEMICONDUCTOR COMPONENTS IND·Filed 1998·Granted Dec 26, 2000·137 cites·9 claims
- 0283US7439100B2Encapsulated chip scale package having flip-chip on lead frame structure and methodSEMICONDUCTOR COMPONENTS IND·Filed 2005·Granted Oct 21, 2008·13 cites·19 claims
- 0376US7656048B2Encapsulated chip scale package having flip-chip on lead frame structureSEMICONDUCTOR COMPONENTS IND·Filed 2008·Granted Feb 2, 2010·7 cites·20 claims
- 0474US7901990B2Method of forming a molded array package device having an exposed tab and structureSEMICONDUCTOR COMPONENTS IND·Filed 2009·Granted Mar 8, 2011·5 cites·11 claims
- 0574US6768186B2Semiconductor device and laminated leadframe packageSEMICONDUCTOR COMPONENTS IND·Filed 2002·Granted Jul 27, 2004·20 cites·21 claims
- 0670US7588999B2Method of forming a leaded molded array packageSEMICONDUCTOR COMPONENTS IND·Filed 2005·Granted Sep 15, 2009·4 cites·14 claims
- 0768US7202105B2Multi-chip semiconductor connector assembly methodSEMICONDUCTOR COMPONENTS IND·Filed 2004·Granted Apr 10, 2007·12 cites·20 claims
- 0867US7298034B2Multi-chip semiconductor connector assembliesSEMICONDUCTOR COMPONENTS IND·Filed 2004·Granted Nov 20, 2007·12 cites·6 claims
- 0967US6081031ASemiconductor package consisting of multiple conductive layersSEMICONDUCTOR COMPONENTS IND·Filed 1998·Granted Jun 27, 2000·27 cites·20 claims
- 1065US7875964B2Multi-chip semiconductor connector and methodSEMICONDUCTOR COMPONENTS IND·Filed 2007·Granted Jan 25, 2011·2 cites·9 claims
- 1163US7602054B2Method of forming a molded array package device having an exposed tab and structureSEMICONDUCTOR COMPONENTS IND·Filed 2005·Granted Oct 13, 2009·2 cites·16 claims
- 1261US7508060B2Multi-chip semiconductor connector assembliesSEMICONDUCTOR COMPONENTS IND·Filed 2007·Granted Mar 24, 2009·2 cites·13 claims
- 1357US8319323B2Electronic package having down-set leads and methodLETTERMAN JR JAMES P·Filed 2004·Granted Nov 27, 2012·10 cites·21 claims
- 1453US7820528B2Method of forming a leaded molded array packageSEMICONDUCTOR COMPONENTS IND·Filed 2009·Granted Oct 26, 2010·0 cites·17 claims
- 1551US7202106B2Multi-chip semiconductor connector and methodSEMICONDUCTOR COMPONENTS IND·Filed 2004·Granted Apr 10, 2007·3 cites·14 claims
- 1649US7498195B2Multi-chip semiconductor connector assembly methodSEMICONDUCTOR COMPONENTS IND·Filed 2007·Granted Mar 3, 2009·0 cites·8 claims
- 1746US7598123B2Semiconductor component and method of manufactureSEMICONDUCTOR COMPONENTS IND·Filed 2007·Granted Oct 6, 2009·0 cites·20 claims
- 1844US8253239B2Multi-chip semiconductor connectorCARNEY FRANCIS J·Filed 2010·Granted Aug 28, 2012·0 cites·4 claims
- 1939US2007117259A1Semiconductor component and method of manufactureSEMICONDUCTOR COMPONENTS IND·Filed 2005·Application pending·0 cites
- 2038US7109064B2Method of forming a semiconductor package and leadframe thereforSEMICONDUCTOR COMPONENTS IND·Filed 2003·Granted Sep 19, 2006·0 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →