Inventor · disambiguated record
Yu-Hsun Wang
Also filed as: WANG YU · WANG YU-HSUN
7 granted patents·7 pending applications·3 citations·filing 2011–2025
72Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD9LIN SHIH-CHIEN2GENERALPLUS TECHNOLOGY INC1GUIZHOU POWER GRID COMPANY LTD1IND TECH RES INST1
Top patents by PatentIndex Score
14 records- 0179US12278162B2Coplanar control for film-type thermal interfaceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 15, 2025·0 cites·20 claims
- 0278US2025357249A1Package assembly including a package lid having a step region and method of making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0377US2025357260A1Heat dissipation for integrated circuit packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0475US2025343166A1Chip package structure with ring structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0574US2025210455A1Coplanar control for film-type thermal interfaceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0672US2025210541A1CHIP PACKAGE STRUCTURE WITH ring structure AND METHOD FOR FORMING THE SAMETAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0771US2025210450A1Heat dissipation for integrated circuit packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0870US11973005B2Coplanar control for film-type thermal interfaceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 30, 2024·0 cites·20 claims
- 0968US12500134B2Package assembly including a package lid having a step region and method of making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 16, 2025·0 cites·20 claims
- 1060US8678296B2Two-dimensional optical identification device with same gray levelLIN SHIH-CHIEN·Filed 2011·Granted Mar 25, 2014·2 cites·13 claims
- 1153US8534565B2Two-dimensional optical identification device with same gray level for quick decoding and decoding method thereforLIN SHIH-CHIEN·Filed 2011·Granted Sep 17, 2013·1 cites·10 claims
- 1246US12308642B2Non-invasive load identification method based on fingerprint characteristics of load powerGUIZHOU POWER GRID COMPANY LTD·Filed 2022·Granted May 20, 2025·0 cites·3 claims
- 1346US12174596B2Grinding and polishing simulation method and system and grinding and polishing process transferring methodIND TECH RES INST·Filed 2020·Granted Dec 24, 2024·0 cites·15 claims
- 1434US2017190375A1Direction Control Method for Self-Balancing Electric Vehicle and Self-Balancing Electric Vehicle Using the SameGENERALPLUS TECHNOLOGY INC·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →