Inventor · disambiguated record
Yukihiro Ikeya
Also filed as: IKEYA YUKIHIRO
6 granted patents·6 pending applications·45 citations·filing 1998–2022
72Inventor score
Top patents by PatentIndex Score
12 records- 0177US6193132B1Method for bonding semiconductor chip and device thereforTOSHIBA KK·Filed 1998·Granted Feb 27, 2001·45 cites·19 claims
- 0264US12403614B2Holding device, cargo handling apparatus, and holding methodTOSHIBA KK·Filed 2022·Granted Sep 2, 2025·0 cites·17 claims
- 0355US11866272B2Holding device, transfer system, support device, placement method, and transfer methodTOSHIBA KK·Filed 2021·Granted Jan 9, 2024·0 cites·18 claims
- 0450US2023075911A1Hand, holding device, and cargo-handling systemTOSHIBA KK·Filed 2022·Application pending·0 cites
- 0549US12006165B2Suction gripping device, transfer system, and transfer methodTOSHIBA KK·Filed 2020·Granted Jun 11, 2024·0 cites·20 claims
- 0648US2023136488A1Transfer apparatus, control device, transfer method, and storage mediumTOSHIBA KK·Filed 2022·Application pending·0 cites
- 0746US2010112734A1Apparatus and method for manufacturing led deviceTOSHIBA KK·Filed 2009·Application pending·0 cites
- 0844US2014259635A1Assembly machine of rotating electrical machine and method for manufacturing rotating electrical machineTOSHIBA KK·Filed 2013·Application pending·0 cites
- 0941US9937600B2Surface treatment apparatus, and surface treatment methodTOSHIBA KK·Filed 2015·Granted Apr 10, 2018·0 cites·17 claims
- 1039US2006164813A1Semiconductor package and semiconductor moduleTOSHIBA KK·Filed 2005·Application pending·0 cites
- 1135US9853279B2Battery and ultrasonic bonding method for batteryAIZAWA TAKAHIRO·Filed 2011·Granted Dec 26, 2017·0 cites·1 claims
- 1226US2006125112A1Apparatus and method for manufacturing semiconductor deviceIKEYA YUKIHIRO·Filed 2005·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Yukihiro Ikeya files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →