Inventor · disambiguated record
Takenori Yanai
Also filed as: YANAI TAKENORI
14 granted patents·2 pending applications·33 citations·filing 1990–2022
88Inventor score
Top patents by PatentIndex Score
16 records- 0182US11525073B2Multilayer circuit board manufacturing methodMITSUI MINING & SMELTING CO LTD·Filed 2017·Granted Dec 13, 2022·3 cites·12 claims
- 0277US11527415B2Multilayer circuit board manufacturing methodMITSUI MINING & SMELTING CO LTD·Filed 2017·Granted Dec 13, 2022·2 cites·8 claims
- 0376US11756845B2Copper foil with glass carrier and production method thereforMITSUI MINING & SMELTING CO LTD·Filed 2019·Granted Sep 12, 2023·2 cites·16 claims
- 0473US10840180B2Production method for multilayer wiring boardMITSUI MINING & SMELTING CO·Filed 2016·Granted Nov 17, 2020·2 cites·12 claims
- 0559US12058819B2Multilayer bodyMITSUI MINING & SMELTING CO LTD·Filed 2019·Granted Aug 6, 2024·0 cites·3 claims
- 0659US11961771B2Laminate sheet and method of use thereofMITSUI MINING & SMELTING CO LTD·Filed 2021·Granted Apr 16, 2024·0 cites·15 claims
- 0757US11765840B2Copper foil with carrierMITSUI MINING & SMELTING CO LTD·Filed 2018·Granted Sep 19, 2023·0 cites·20 claims
- 0854US11637358B2Carrier-containing metal foil and method for manufacturing millimeter-wave antenna substrate using sameMITSUI MINING & SMELTING CO LTD·Filed 2019·Granted Apr 25, 2023·0 cites·11 claims
- 0954US7469728B2Fluid injecting deviceMURATA MACHINERY LTD·Filed 2006·Granted Dec 30, 2008·0 cites·3 claims
- 1054US5147177APackage palletizing systemMURATA MACHINERY LTD·Filed 1991·Granted Sep 15, 1992·9 cites·6 claims
- 1148US2025065617A1Sheet fixing device, sheet peeling device, and sheet peeling methodMITSUI MINING & SMELTING CO LTD·Filed 2022·Application pending·0 cites
- 1245US5588523ARoller driving deviceMURATA MACHINERY LTD·Filed 1994·Granted Dec 31, 1996·10 cites·4 claims
- 1345US5059087ABobbin conveying systemMURATA MACHINERY LTD·Filed 1990·Granted Oct 22, 1991·3 cites·3 claims
- 1443US2023420270A1Method for producing wiring boardMITSUI MINING & SMELTING CO LTD·Filed 2021·Application pending·0 cites
- 1540US12302504B2Production method for multilayer wiring boardMITSUI MINING & SMELTING CO LTD·Filed 2016·Granted May 13, 2025·0 cites·14 claims
- 1633US5096245APackage palletizing systemMURATA MACHINERY LTD·Filed 1990·Granted Mar 17, 1992·2 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →