Inventor · disambiguated record
Bo Yun Kim
Also filed as: KIM BO YUN
12 granted patents·3 pending applications·9 citations·filing 2013–2022
84Inventor score
Top patents by PatentIndex Score
15 records- 0183US10748968B2Image sensor having an etch stop layer on the insulation layerSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Aug 18, 2020·1 cites·20 claims
- 0278US11094586B2Semiconductor device including interconnections having different structures and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Aug 17, 2021·3 cites·20 claims
- 0376US9677002B2Etching compositionSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Jun 13, 2017·2 cites·6 claims
- 0474US11764291B2Method of diffusing nitrogen into a tunnel layer of a nonvolatile memorySK HYNIX INC·Filed 2022·Granted Sep 19, 2023·0 cites·10 claims
- 0568US11251229B2Method of manufacturing an image sensor having an etch stop layer on an insulation layerSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Feb 15, 2022·0 cites·20 claims
- 0665US2023211456A1Polishing pad for chemical mechanical polishing, chemical mechanical polishing apparatus inluding the same, and method of fabricating semiconductor device using the chemical mechanical polishing apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 0764US9165759B2Etching composition and method of manufacturing semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Oct 20, 2015·1 cites·15 claims
- 0861US11778833B2Nonvolatile memory deviceSK HYNIX INC·Filed 2021·Granted Oct 3, 2023·0 cites·19 claims
- 0961US11437499B2Nonvolatile memory device and method of fabricating the sameSK HYNIX INC·Filed 2019·Granted Sep 6, 2022·0 cites·8 claims
- 1061US9827592B2Ultrasonic probe and method of manufacturing the sameSAMSUNG MEDISON CO LTD·Filed 2014·Granted Nov 28, 2017·2 cites·10 claims
- 1156US11217598B2Nonvolatile memory deviceSK HYNIX INC·Filed 2019·Granted Jan 4, 2022·0 cites·8 claims
- 1254US10829690B2Slurry composition for chemical mechanical polishing, method of preparing the same, and method of fabricating semiconductor device by using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Nov 10, 2020·0 cites·20 claims
- 1354US2023301104A1Three-dimensional semiconductor device and method of manufacturing the three-dimensional semiconductor deviceSK HYNIX INC·Filed 2022·Application pending·0 cites
- 1453US11279852B2CMP slurry compositions and methods of fabricating a semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Mar 22, 2022·0 cites·16 claims
- 1537US2013183824A1Method of fabricating a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Bo Yun Kim files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →