Inventor · disambiguated record
Matthias Hierlemann
Also filed as: HIERLEMANN MATTHIAS · HIERLEMANN MATTHIAS P
23 granted patents·2 pending applications·161 citations·filing 2002–2015
95Inventor score
Top patents by PatentIndex Score
25 records- 0196US8772087B2Method and apparatus for semiconductor device fabrication using a reconstituted waferBARTH HANS-JOACHIM·Filed 2009·Granted Jul 8, 2014·43 cites·26 claims
- 0287US7586158B2Piezoelectric stress liner for bulk and SOIINFINEON TECHNOLOGIES AG·Filed 2005·Granted Sep 8, 2009·21 cites·36 claims
- 0387US7205639B2Semiconductor devices with rotated substrates and methods of manufacture thereofIBM·Filed 2005·Granted Apr 17, 2007·12 cites·16 claims
- 0486US8338887B2Buried gate transistorLINDSAY RICHARD·Filed 2005·Granted Dec 25, 2012·12 cites·16 claims
- 0586US7250650B2Field-effect transistor structure and associated semiconductor memory cellINFINEON TECHNOLOGIES AG·Filed 2005·Granted Jul 31, 2007·14 cites·14 claims
- 0683US8796762B2Buried gate transistorINFINEON TECHNOLOGIES AG·Filed 2012·Granted Aug 5, 2014·5 cites·23 claims
- 0782US7172954B2Implantation process in semiconductor fabricationINFINEON TECHNOLOGIES AG·Filed 2005·Granted Feb 6, 2007·7 cites·13 claims
- 0878US8016941B2Method and apparatus for manufacturing a semiconductorINFINEON TECHNOLOGIES AG·Filed 2007·Granted Sep 13, 2011·7 cites·15 claims
- 0976US8319285B2Silicon-on-insulator chip having multiple crystal orientationsTILKE ARMIN·Filed 2005·Granted Nov 27, 2012·6 cites·15 claims
- 1076US7449374B2Methods of manufacturing semiconductor devices with rotated substratesINFINEON TECHNOLOGIES AG·Filed 2007·Granted Nov 11, 2008·5 cites·24 claims
- 1174US8748295B2Pads with different width in a scribe line region and method for manufacturing these padsKALTALIOGLU ERDEM·Filed 2009·Granted Jun 10, 2014·4 cites·30 claims
- 1271US8999756B2Method and apparatus for semiconductor device fabrication using a reconstituted waferINFINEON TECHNOLOGIES AG·Filed 2014·Granted Apr 7, 2015·2 cites·23 claims
- 1370US8101985B2Capacitors and methods of manufacture thereofHIERLEMANN MATTHIAS·Filed 2010·Granted Jan 24, 2012·3 cites·22 claims
- 1470US7863130B2Tunable stressed polycrystalline silicon on dielectrics in an integrated circuitINFINEON TECHNOLOGIES AG·Filed 2007·Granted Jan 4, 2011·2 cites·18 claims
- 1568US7358167B2Implantation process in semiconductor fabricationINFINEON TECHNOLOGIES AG·Filed 2006·Granted Apr 15, 2008·2 cites·17 claims
- 1666US6864171B1Via density rulesINFINEON TECHNOLOGIES AG·Filed 2003·Granted Mar 8, 2005·13 cites·15 claims
- 1753US10217812B2Silicon-on-insulator chip having multiple crystal orientationsINFINEON TECHNOLOGIES AG·Filed 2012·Granted Feb 26, 2019·0 cites·14 claims
- 1852US9059141B2Buried gate transistorINFINEON TECHNOLOGIES AG·Filed 2012·Granted Jun 16, 2015·0 cites·13 claims
- 1952US7786007B2Method and apparatus of stress relief in semiconductor structuresINFINEON TECHNOLOGIES AG·Filed 2008·Granted Aug 31, 2010·0 cites·18 claims
- 2050US2015318394A1Tunable Stressed Polycrystalline Silicon on Dielectrics in an Integrated CircuitINFINEON TECHNOLOGIES AG·Filed 2015·Application pending·0 cites
- 2148US9105747B2Tunable stressed polycrystalline silicon on dielectrics in an integrated circuitHIERLEMANN MATTHIAS·Filed 2010·Granted Aug 11, 2015·0 cites·11 claims
- 2247US7368804B2Method and apparatus of stress relief in semiconductor structuresINFINEON TECHNOLOGIES AG·Filed 2003·Granted May 6, 2008·2 cites·19 claims
- 2346US7851302B2Capacitors and methods of manufacture thereofINFINEON TECHNOLOGIES AG·Filed 2005·Granted Dec 14, 2010·0 cites·20 claims
- 2444US2005221610A1Method and apparatus of stress relief in semiconductor structuresHOINKIS MARK·Filed 2005·Application pending·0 cites
- 2542US6876026B2Memory cell, wafer, semiconductor component with memory cell having insulation collars and method for fabricating an insulating collar for a memory cellINFINEON TECHNOLOGIES AG·Filed 2002·Granted Apr 5, 2005·1 cites·24 claims
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