Inventor · disambiguated record

Kouji Shika

Also filed as: SHIKA KOUJI

2 granted patents·81 citations·filing 1991–1992

68Inventor score

Technology areasH10W

Files withMITSUBISHI ELECTRIC CORP2

Top patents by PatentIndex Score

2 records

0175US5288698AMethod of positioning lead frame on molding die to seal semiconductor element with resinMITSUBISHI ELECTRIC CORP·Filed 1992·Granted Feb 22, 1994·50 cites·9 claims
0263US5123823AMolding device for sealing semiconductor element with resinMITSUBISHI ELECTRIC CORP·Filed 1991·Granted Jun 23, 1992·31 cites·11 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →