Inventor · disambiguated record
Steffen K. Kaldor
Also filed as: KALDOR STEFFEN · KALDOR STEFFEN K
11 granted patents·1 pending application·217 citations·filing 2001–2006
91Inventor score
Top patents by PatentIndex Score
12 records- 0195US6975032B2Copper recess process with application to selective capping and electroless platingIBM·Filed 2002·Granted Dec 13, 2005·85 cites·19 claims
- 0292US7064064B2Copper recess process with application to selective capping and electroless platingIBM·Filed 2005·Granted Jun 20, 2006·22 cites·10 claims
- 0389US7241681B2Bilayered metal hardmasks for use in dual damascene etch schemesIBM·Filed 2006·Granted Jul 10, 2007·13 cites·8 claims
- 0480US7122462B2Back end interconnect with a shaped interfaceINFINEON TECHNOLOGIES AG·Filed 2003·Granted Oct 17, 2006·25 cites·5 claims
- 0576US7052621B2Bilayered metal hardmasks for use in Dual Damascene etch schemesIBM·Filed 2003·Granted May 30, 2006·15 cites·15 claims
- 0674US7098537B2Interconnect structure diffusion barrier with high nitrogen contentIBM·Filed 2003·Granted Aug 29, 2006·17 cites·7 claims
- 0773US7241696B2Method for depositing a metal layer on a semiconductor interconnect structure having a capping layerINFINEON TECHNOLOGIES AG·Filed 2002·Granted Jul 10, 2007·20 cites·19 claims
- 0873US7214548B2Apparatus and method for flattening a warped substrateIBM·Filed 2004·Granted May 8, 2007·18 cites·29 claims
- 0964US7378338B2Method of forming an interconnect structure diffusion barrier with high nitrogen contentIBM·Filed 2006·Granted May 27, 2008·2 cites·10 claims
- 1049US7494915B2Back end interconnect with a shaped interfaceIBM·Filed 2006·Granted Feb 24, 2009·0 cites·7 claims
- 1140US7001835B2Crystallographic modification of hard mask propertiesINFINEON TECHNOLOGIES AG·Filed 2003·Granted Feb 21, 2006·0 cites·10 claims
- 1235US2002163062A1Multiple material stacks with a stress relief layer between a metal structure and a passivation layerIBM·Filed 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →