Inventor · disambiguated record
Mukul Renavikar
Also filed as: RENAVIKAR MUKUL · RENAVIKAR MUKUL P
17 granted patents·8 pending applications·98 citations·filing 2004–2023
92Inventor score
Top patents by PatentIndex Score
25 records- 0193US7239517B2Integrated heat spreader and method for usingINTEL CORP·Filed 2005·Granted Jul 3, 2007·25 cites·7 claims
- 0290US7700476B2Solder joint reliability in microelectronic packagingINTEL CORP·Filed 2006·Granted Apr 20, 2010·15 cites·19 claims
- 0387US7183641B2Integrated heat spreader with intermetallic layer and method for makingINTEL CORP·Filed 2005·Granted Feb 27, 2007·15 cites·16 claims
- 0484US8409929B2Forming a semiconductor package including a thermal interface materialRENAVIKAR MUKUL·Filed 2011·Granted Apr 2, 2013·7 cites·14 claims
- 0583US11817364B2BGA STIM package architecture for high performance systemsINTEL CORP·Filed 2018·Granted Nov 14, 2023·3 cites·15 claims
- 0682US8701281B2Substrate metallization and ball attach metallurgy with a novel dopant elementSIDHU RAJEN S·Filed 2009·Granted Apr 22, 2014·11 cites·7 claims
- 0775US8733620B2Solder deposition and thermal processing of thin-die thermal interface materialRENAVIKAR MUKUL·Filed 2005·Granted May 27, 2014·8 cites·7 claims
- 0873US7485495B2Integrated heat spreader with intermetallic layer and method for makingINTEL CORP·Filed 2007·Granted Feb 3, 2009·5 cites·17 claims
- 0971US8030757B2Forming a semiconductor package including a thermal interface materialINTEL CORP·Filed 2007·Granted Oct 4, 2011·4 cites·10 claims
- 1071US2024030086A1Bga stim package architecture for high performance systemsINTEL CORP·Filed 2023·Application pending·0 cites
- 1168US2025128362A1Micrometer metal particle reinforced tin-bismuth low temperature solder materialsINTEL CORP·Filed 2023·Application pending·0 cites
- 1263US7553702B2Integrating a heat spreader with an interface material having reduced void sizeINTEL CORP·Filed 2007·Granted Jun 30, 2009·2 cites·18 claims
- 1362US9613933B2Package structure to enhance yield of TMI interconnectionsDE BONIS THOMAS J·Filed 2014·Granted Apr 4, 2017·2 cites·20 claims
- 1460US9394619B2Methods of adding dopants to conductive interconnect structures in substrate technologies and structures formed therebyINTEL CORP·Filed 2013·Granted Jul 19, 2016·0 cites·23 claims
- 1559US8018063B2Solder joint reliability in microelectronic packagingINTEL CORP·Filed 2009·Granted Sep 13, 2011·0 cites·20 claims
- 1659US2025218992A1Core-shell ball grid array materials for large form factor integrated circuit packagesINTEL CORP·Filed 2023·Application pending·0 cites
- 1755US2024222182A1Method and apparatus for a silicon die preparation including auxetic and electrostatic dissipatative featuresINTEL CORP·Filed 2022·Application pending·0 cites
- 1853US8436470B2Solder joint reliability in microelectronic packagingSUH DAEWOONG·Filed 2010·Granted May 7, 2013·0 cites·10 claims
- 1952US10049971B2Package structure to enhance yield of TMI interconnectionsINTEL CORP·Filed 2017·Granted Aug 14, 2018·0 cites·3 claims
- 2043US2014175160A1Solder paste material technology for elimination of high warpage surface mount assembly defectsSIDHU RAJEN S·Filed 2012·Application pending·0 cites
- 2142US7087521B2Forming an intermediate layer in interconnect joints and structures formed therebyINTEL CORP·Filed 2004·Granted Aug 8, 2006·0 cites·36 claims
- 2236US7205595B2Polymer memory device with electron trapsINTEL CORP·Filed 2004·Granted Apr 17, 2007·1 cites·22 claims
- 2335US2019057936A1Transmissive composite film for application to the backside of a microelectronic deviceINTEL CORP·Filed 2015·Application pending·0 cites
- 2434US2007228111A1Microelectronic package and method of forming sameVASUDEVANPILLAI GANESH V·Filed 2006·Application pending·0 cites
- 2529US2017053858A1Substrate on substrate packageINTEL CORP·Filed 2015·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →