Inventor · disambiguated record
Akihiko Kishimoto
Also filed as: KISHIMOTO AKIHIKO
10 granted patents·1 pending application·260 citations·filing 1974–2009
91Inventor score
Top patents by PatentIndex Score
11 records- 0195US3981944AMethod for producing impact resistant thermoplastic resin by continuous bulk polymerizationTORAY INDUSTRIES·Filed 1974·Granted Sep 21, 1976·70 cites·9 claims
- 0293US4889893APolyphenylene sulfide resin composition and a process for producing itTORAY INDUSTRIES·Filed 1988·Granted Dec 26, 1989·66 cites·9 claims
- 0383US4543390AAntistatic resinous compositionsTORAY INDUSTRIES·Filed 1984·Granted Sep 24, 1985·39 cites·15 claims
- 0473US5115456AMask for exposing wafer with radiation and its exposing methodHITACHI LTD·Filed 1989·Granted May 19, 1992·22 cites·8 claims
- 0572US5338795AHousing and thermoplastic resin compositions including polyether ester amide, styrene based resin and vinyl copolymerTORAY INDUSTRIES·Filed 1992·Granted Aug 16, 1994·19 cites·13 claims
- 0665US3950455AMethod for graft polymerization of diene polymerTORAY INDUSTRIES·Filed 1974·Granted Apr 13, 1976·12 cites·7 claims
- 0763US5834561AInstrinsically antistatic thermoplastic resin compositions housing and resin composition including polyether ester amide, polyphenylene ether resin and vinyl polymerTORAY INDUSTRIES·Filed 1995·Granted Nov 10, 1998·13 cites·6 claims
- 0856US5500478AHousing and resin composition including polyether ester amide, polycarbonate resin and modified vinyl polymerTORAY INDUSTRIES·Filed 1994·Granted Mar 19, 1996·8 cites·8 claims
- 0954US8975066B2DNA analysis apparatusKAMBARA HIDEKI·Filed 2009·Granted Mar 10, 2015·0 cites·11 claims
- 1054US5886097AHousing and resin composition including polyether ester amide, thermoplastic resin, vinyl polymer and halogenTORAY INDUSTRIES·Filed 1997·Granted Mar 23, 1999·11 cites·13 claims
- 1151US2007054283A1DNA sequencing method using step by step reactionHITACHI LTD·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →