Inventor · disambiguated record
Marie-Claude Paquet
Also filed as: PAQUET MARIE-CLAUDE
17 granted patents·2 pending applications·58 citations·filing 2002–2019
92Inventor score
Top patents by PatentIndex Score
19 records- 0191US9698072B2Low-stress dual underfill packagingIBM·Filed 2015·Granted Jul 4, 2017·8 cites·5 claims
- 0283US8159067B2Underfill flow guide structuresDAUBENSPECK TIMOTHY H·Filed 2008·Granted Apr 17, 2012·8 cites·11 claims
- 0380US9627784B1Method and apparatus for strain relieving surface mount attached connectorsIBM·Filed 2015·Granted Apr 18, 2017·2 cites·10 claims
- 0478US8580673B2Underfill flow guide structures and method of using sameULTRATECH INC·Filed 2013·Granted Nov 12, 2013·3 cites·5 claims
- 0576US10338325B1Nanofiller in an optical interfaceIBM·Filed 2018·Granted Jul 2, 2019·2 cites·19 claims
- 0676US6988882B2Transfer molding of integrated circuit packagesIBM·Filed 2005·Granted Jan 24, 2006·7 cites·16 claims
- 0775US9373559B2Low-stress dual underfill packagingIBM·Filed 2014·Granted Jun 21, 2016·3 cites·4 claims
- 0869US8299581B2Passivation layer extension to chip edgeDAUBENSPECK TIMOTHY H·Filed 2010·Granted Oct 30, 2012·3 cites·18 claims
- 0966US10368441B2Method and apparatus for strain relieving surface mount attached connectorsIBM·Filed 2018·Granted Jul 30, 2019·1 cites·20 claims
- 1061US6956296B2Transfer molding of integrated circuit packagesIBM·Filed 2003·Granted Oct 18, 2005·9 cites·3 claims
- 1161US6656773B2Transfer molding of integrated circuit packagesIBM·Filed 2002·Granted Dec 2, 2003·9 cites·10 claims
- 1259US9974179B2Method and apparatus for strain relieving surface mount attached connectorsIBM·Filed 2017·Granted May 15, 2018·0 cites·6 claims
- 1359US8786059B2Passivation layer surface topography modifications for improved integrity in packaged assembliesBLANDER ALEXANDRE·Filed 2012·Granted Jul 22, 2014·1 cites·17 claims
- 1456US8236615B2Passivation layer surface topography modifications for improved integrity in packaged assembliesBLANDER ALEXANDRE·Filed 2009·Granted Aug 7, 2012·1 cites·9 claims
- 1554US10750615B2Method and apparatus for strain relieving surface mount attached connectorsIBM·Filed 2019·Granted Aug 18, 2020·0 cites·20 claims
- 1654US8796049B2Underfill adhesion measurements at a microscopic scaleCADOTTE MAXIME·Filed 2012·Granted Aug 5, 2014·1 cites·20 claims
- 1753US8409980B2Underfill flow guide structures and method of using sameDAUBENSPECK TIMOTHY H·Filed 2012·Granted Apr 2, 2013·0 cites·15 claims
- 1848US2013161822A1Controlling density of particles within underfill surrounding solder bump contactsIBM·Filed 2013·Application pending·0 cites
- 1943US2012168956A1Controlling density of particles within underfill surrounding solder bump contactsBARBEAU STEPHANE S·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →