Inventor · disambiguated record
Ren-Wei Xiao
Also filed as: XIAO REN-WEI
5 granted patents·1 pending application·6 citations·filing 2012–2024
69Inventor score
Top patents by PatentIndex Score
6 records- 0180US9177914B2Metal pad structure over TSV to reduce shorting of upper metal layerTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Nov 3, 2015·5 cites·20 claims
- 0263US9530690B2Metal pad structure over TSV to reduce shorting of upper metal layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Dec 27, 2016·1 cites·20 claims
- 0354US9984971B2Methods of forming metal pad structures over TSVS to reduce shorting of upper metal layersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 29, 2018·0 cites·20 claims
- 0451US2025314917A1Semiconductor photonics devices and methods of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0550US10050103B2Method of forming semiconductor structures including metal insulator metal capacitorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Aug 14, 2018·0 cites·20 claims
- 0650US9666660B2Semiconductor structures including metal insulator metal capacitorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted May 30, 2017·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →