Inventor · disambiguated record
Francois-Charles Dary
Also filed as: DARY FRANCOIS · DARY FRANCOIS C · DARY FRANCOIS-CHARLES · DARY FRANCOIS-CHARLES HENRI
21 granted patents·3 pending applications·80 citations·filing 2001–2022
94Inventor score
Top patents by PatentIndex Score
24 records- 0196US10049793B2Fabrication of reinforced superconducting wiresAIMONE PAUL·Filed 2016·Granted Aug 14, 2018·7 cites·22 claims
- 0294US8703233B2Methods of manufacturing large-area sputtering targets by cold spraySTARCK H C INC·Filed 2012·Granted Apr 22, 2014·11 cites·27 claims
- 0392US10679775B2Fabrication of reinforced superconducting wiresAIMONE PAUL·Filed 2018·Granted Jun 9, 2020·4 cites·21 claims
- 0491US11392257B2Copper-alloy capping layers for metallization in touch-panel displaysSUN SHUWEI·Filed 2021·Granted Jul 19, 2022·2 cites·21 claims
- 0589US10401994B2Electronic devices having bilayer capping layers and/or barrier layersSTARCK H C INC·Filed 2018·Granted Sep 3, 2019·4 cites·20 claims
- 0688US10558284B2Electronic devices having bilayer capping layers and/or barrier layersSTARCK H C INC·Filed 2019·Granted Feb 11, 2020·3 cites·18 claims
- 0787US9299472B2Copper-alloy barrier layers for metallization in thin-film transistors and flat panel displaysSUN SHUWEI·Filed 2014·Granted Mar 29, 2016·7 cites·22 claims
- 0883US11814312B2Corrosion-resistant glass melt electrodes and methods of using themAIMONE PAUL·Filed 2020·Granted Nov 14, 2023·1 cites·20 claims
- 0983US6551375B2Ammunition using non-toxic metals and bindersKENNAMETAL INC·Filed 2001·Granted Apr 22, 2003·34 cites·22 claims
- 1082US10916569B2Thin-film transistor and method of forming an electrode of a thin-film transistorSUN SHUWEI·Filed 2018·Granted Feb 9, 2021·2 cites·20 claims
- 1180US10877582B2Electronic devices having bilayer capping layers and/or barrier layersSTARCK H C INC·Filed 2020·Granted Dec 29, 2020·1 cites·23 claims
- 1277US11640222B2Copper-alloy capping layers for metallization in touch-panel displaysSUN SHUWEI·Filed 2022·Granted May 2, 2023·0 cites·20 claims
- 1377US11599210B2Electronic devices having bilayer capping layers and/or barrier layersSTARCK H C INC·Filed 2022·Granted Mar 7, 2023·0 cites·23 claims
- 1477US10739879B2Current-induced dark layer formation for metallization in electronic devicesHC STARCK INC·Filed 2018·Granted Aug 11, 2020·2 cites·30 claims
- 1573US11281317B2Electronic devices having bilayer capping layers and/or barrier layersSTARCK H C INC·Filed 2020·Granted Mar 22, 2022·0 cites·20 claims
- 1673US9929187B2Copper-alloy capping layers for metallization in touch-panel displaysSUN SHUWEI·Filed 2014·Granted Mar 27, 2018·2 cites·31 claims
- 1772US11327587B2Current-induced dark layer formation for metallization in electronic devicesSTARCK H C INC·Filed 2020·Granted May 10, 2022·0 cites·30 claims
- 1869US11417445B2Fabrication of reinforced superconducting wiresAIMONE PAUL·Filed 2020·Granted Aug 16, 2022·0 cites·19 claims
- 1962US10604434B2Corrosion-resistant glass melt electrodes and methods of using themAIMONE PAUL·Filed 2015·Granted Mar 31, 2020·0 cites·22 claims
- 2060US9412568B2Large-area sputtering targetsSTARCK H C INC·Filed 2012·Granted Aug 9, 2016·0 cites·30 claims
- 2153US2016172386A1Copper-alloy barrier layers for metallization in thin-film transistors and flat panel displaysSUN SHUWEI·Filed 2016·Application pending·0 cites
- 2244US11123029B2Method for producing a grid-like beam collimator, grid-like beam collimator comprising a grid structure having metal particles and a cured stiffening material, radiation detector, and medical imaging deviceSIEMENS HEALTHCARE GMBH·Filed 2019·Granted Sep 21, 2021·0 cites·21 claims
- 2342US2005072668A1Sputter target having modified surface textureHERAEUS INC·Filed 2004·Application pending·0 cites
- 2437US2006110626A1Carbon containing sputter target alloy compositionsHERAEUS INC·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →