Inventor · disambiguated record
Tadahiko Sakai
Also filed as: SAKAI TADAHIKO
57 granted patents·12 pending applications·795 citations·filing 1994–2022
98Inventor score
Files withMATSUSHITA ELECTRIC INDUSTRIAL CO LTD28PANASONIC CORP14PANASONIC IP MAN CO LTD8WADA YOSHIYUKI5MOTOMURA KOJI3
Top patents by PatentIndex Score
69 records- 0191US8434665B2Electronic component mounting system and electronic component mounting methodMOTOMURA KOJI·Filed 2010·Granted May 7, 2013·17 cites·3 claims
- 0291US5516032AMethod for forming bump electrodeMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1994·Granted May 14, 1996·61 cites·9 claims
- 0384US6797544B2Semiconductor device, method of manufacturing the device and method of mounting the deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Sep 28, 2004·37 cites·23 claims
- 0484US5534127AMethod of forming solder bumps on electrodes of electronic componentMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1995·Granted Jul 9, 1996·78 cites·10 claims
- 0583US6189771B1Method of forming solder bump and method of mounting the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1999·Granted Feb 20, 2001·50 cites·16 claims
- 0682US7632710B2Method for soldering electronic component and soldering structure of electronic componentPANASONIC CORP·Filed 2006·Granted Dec 15, 2009·10 cites·9 claims
- 0782US6209196B1Method of mounting bumped electronic componentsMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1999·Granted Apr 3, 2001·46 cites·22 claims
- 0882US5657528AMethod of transferring conductive ballsMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1995·Granted Aug 19, 1997·47 cites·12 claims
- 0981US7966721B2Electronic component mounting method and electronic component mounting devicePANASONIC CORP·Filed 2005·Granted Jun 28, 2011·12 cites·4 claims
- 1081US7793413B2Method of mounting electronic componentsPANASONIC CORP·Filed 2006·Granted Sep 14, 2010·10 cites·4 claims
- 1178US7797822B2Electronic component mounting methodPANASONIC CORP·Filed 2006·Granted Sep 21, 2010·10 cites·2 claims
- 1276US6390351B1Apparatus and method of transferring conductive balls and apparatus and method of supplying conductive ballsMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted May 21, 2002·25 cites·25 claims
- 1375US9756728B2Component-mounted structurePANASONIC IP MAN CO LTD·Filed 2013·Granted Sep 5, 2017·4 cites·15 claims
- 1472US6179198B1Method of soldering bumped work by partially penetrating the oxide film covering the solder bumpsMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted Jan 30, 2001·41 cites·6 claims
- 1572US5428505APrinted circuit boardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1994·Granted Jun 27, 1995·32 cites·27 claims
- 1671US8034447B2Electronic components mounting adhesive and electronic components mounting structurePANASONIC CORP·Filed 2007·Granted Oct 11, 2011·5 cites·7 claims
- 1771US5867260AConductive ball mounting apparatus and mounting method of conductive ballMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted Feb 2, 1999·43 cites·9 claims
- 1870US6000127AElectronic parts mounting methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted Dec 14, 1999·38 cites·4 claims
- 1967US9516749B2Electronic component-mounted structure, IC card and COF packagePANASONIC IP MAN CO LTD·Filed 2013·Granted Dec 6, 2016·2 cites·14 claims
- 2066US9999123B2Connection structure of circuit member, connection method, and connection materialPANASONIC IP MAN CO LTD·Filed 2016·Granted Jun 12, 2018·1 cites·28 claims
- 2166US8083121B2Paste for soldering and soldering method using the sameMAEDA TADASHI·Filed 2005·Granted Dec 27, 2011·3 cites·4 claims
- 2266US5894984AStructure of electronic parts and method of soldering electronic parts to substrateMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1996·Granted Apr 20, 1999·31 cites·7 claims
- 2365US8188605B2Components joining method and components joining structureSAKAI TADAHIKO·Filed 2011·Granted May 29, 2012·2 cites·8 claims
- 2465US6065201AMethod of transferring conductive balls onto work pieceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1998·Granted May 23, 2000·31 cites·19 claims
- 2564US8960526B2Flux for soldering and soldering processMAEDA TADASHI·Filed 2005·Granted Feb 24, 2015·2 cites·13 claims
- 2664US8148253B2Electronic component soldering structure and electronic component soldering methodOZONO MITSURU·Filed 2006·Granted Apr 3, 2012·4 cites·6 claims
- 2764US8025205B2Electronic component mounting methodPANASONIC CORP·Filed 2006·Granted Sep 27, 2011·3 cites·6 claims
- 2864US5447267AMethod of soldering electronic part using a bond for tacking the electronic partMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1994·Granted Sep 5, 1995·20 cites·1 claims
- 2963US8018074B2Components joining method and components joining structurePANASONIC CORP·Filed 2007·Granted Sep 13, 2011·2 cites·5 claims
- 3063US7886432B2Electric components connecting methodPANASONIC CORP·Filed 2007·Granted Feb 15, 2011·3 cites·6 claims
- 3163US7845074B2Method for manufacturing electronic parts modulePANASONIC CORP·Filed 2009·Granted Dec 7, 2010·3 cites·7 claims
- 3262US12439527B2Mounting board manufacturing method and flux coating devicePANASONIC IP MAN CO LTD·Filed 2021·Granted Oct 7, 2025·0 cites·13 claims
- 3362US8686299B2Electronic element unit and reinforcing adhesive agentMOTOMURA KOJI·Filed 2010·Granted Apr 1, 2014·2 cites·5 claims
- 3462US7568610B2Method of soldering electronic component having solder bumps to substratePANASONIC CORP·Filed 2005·Granted Aug 4, 2009·2 cites·7 claims
- 3558US9015932B2Connecting method of electronic componentSAKAI TADAHIKO·Filed 2007·Granted Apr 28, 2015·2 cites·5 claims
- 3658US6536105B1Method for mounting conductive balls on a substrateMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Mar 25, 2003·7 cites·16 claims
- 3758US5890283AApparatus and method for mounting electrically conductive ballsMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted Apr 6, 1999·24 cites·8 claims
- 3857US5962925AMounting structure of electronic component having bumpsMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1998·Granted Oct 5, 1999·22 cites·7 claims
- 3956US6109509AMethod of securely mounting conductive ballsMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted Aug 29, 2000·18 cites·5 claims
- 4055US12484157B2Adhesive for provisionally fixing electronic component to solder precoat and method for producing electronic component mounted substratePANASONIC IP MAN CO LTD·Filed 2021·Granted Nov 25, 2025·0 cites·6 claims
- 4155US6617675B2Semiconductor device and semiconductor device assemblyMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Sep 9, 2003·6 cites·8 claims
- 4254US12402255B2Method for producing electronic component mounted substratePANASONIC IP MAN CO LTD·Filed 2022·Granted Aug 26, 2025·0 cites·4 claims
- 4353US6852572B2Method of manufacturing semiconductor deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Feb 8, 2005·5 cites·22 claims
- 4452US9609760B2Electronic component mounting methodSAEKI TSUBASA·Filed 2012·Granted Mar 28, 2017·1 cites·8 claims
- 4552US8851138B2Substrate backing device and substrate thermocompression-bonding deviceMARUO HIROKI·Filed 2011·Granted Oct 7, 2014·1 cites·10 claims
- 4652US7446423B2Semiconductor device and method for assembling the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Nov 4, 2008·10 cites·19 claims
- 4750US2024282594A1Electronic-component-mounting-substrate manufacturing methodPANASONIC IP MAN CO LTD·Filed 2022·Application pending·0 cites
- 4849US9839143B2Electrode joining method, production method of electrode joined structurePANASONIC CORP·Filed 2013·Granted Dec 5, 2017·0 cites·8 claims
- 4949US8499998B2Component built-in circuit substrate and method of producing the sameWADA YOSHIYUKI·Filed 2009·Granted Aug 6, 2013·0 cites·7 claims
- 5049US2007278456A1Solder pasteMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2007·Application pending·0 cites
Showing the top 50 of 69 patent records by PatentIndex Score.
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