Inventor · disambiguated record
Koji Motomura
Also filed as: MOTOMURA KOJI
24 granted patents·6 pending applications·39 citations·filing 2009–2018
92Inventor score
Top patents by PatentIndex Score
30 records- 0191US8434665B2Electronic component mounting system and electronic component mounting methodMOTOMURA KOJI·Filed 2010·Granted May 7, 2013·17 cites·3 claims
- 0280US10080298B2Circuit board interconnection structure and circuit board interconnection methodPANASONIC CORP·Filed 2014·Granted Sep 18, 2018·4 cites·10 claims
- 0377US9237686B2Method and system for producing component mounting boardPANASONIC CORP·Filed 2013·Granted Jan 12, 2016·5 cites·6 claims
- 0475US9756728B2Component-mounted structurePANASONIC IP MAN CO LTD·Filed 2013·Granted Sep 5, 2017·4 cites·15 claims
- 0567US9516749B2Electronic component-mounted structure, IC card and COF packagePANASONIC IP MAN CO LTD·Filed 2013·Granted Dec 6, 2016·2 cites·14 claims
- 0663US7845074B2Method for manufacturing electronic parts modulePANASONIC CORP·Filed 2009·Granted Dec 7, 2010·3 cites·7 claims
- 0762US8686299B2Electronic element unit and reinforcing adhesive agentMOTOMURA KOJI·Filed 2010·Granted Apr 1, 2014·2 cites·5 claims
- 0856US10464003B2FilterPANASONIC IP MAN CO LTD·Filed 2017·Granted Nov 5, 2019·0 cites·9 claims
- 0956US10464285B2Laminate and manufacturing method thereofPANASONIC IP MAN CO LTD·Filed 2016·Granted Nov 5, 2019·0 cites·13 claims
- 1056US10413856B2Stacked bodyPANASONIC IP MAN CO LTD·Filed 2017·Granted Sep 17, 2019·0 cites·7 claims
- 1152US9609760B2Electronic component mounting methodSAEKI TSUBASA·Filed 2012·Granted Mar 28, 2017·1 cites·8 claims
- 1252US8851138B2Substrate backing device and substrate thermocompression-bonding deviceMARUO HIROKI·Filed 2011·Granted Oct 7, 2014·1 cites·10 claims
- 1351US10464286B2Laminated nonwoven fabric and manufacturing method thereofPANASONIC IP MAN CO LTD·Filed 2016·Granted Nov 5, 2019·0 cites·7 claims
- 1451US10232293B2Fiber laminate and manufacturing method thereofPANASONIC IP MAN CO LTD·Filed 2017·Granted Mar 19, 2019·0 cites·11 claims
- 1550US9795036B2Mounting structure and method for manufacturing samePANASONIC IP MAN CO LTD·Filed 2013·Granted Oct 17, 2017·0 cites·10 claims
- 1649US10412834B2Mounting structure and method for manufacturing samePANASONIC IP MAN CO LTD·Filed 2017·Granted Sep 10, 2019·0 cites·8 claims
- 1749US9839143B2Electrode joining method, production method of electrode joined structurePANASONIC CORP·Filed 2013·Granted Dec 5, 2017·0 cites·8 claims
- 1848US10173158B2Laminated nonwoven fabric, air purifier, and manufacturing method of laminated nonwoven fabricPANASONIC IP MAN CO LTD·Filed 2016·Granted Jan 8, 2019·0 cites·10 claims
- 1947US10786876B2Mounting Method of a semiconductor device using a colored auxiliary joining agentPANASONIC IP MAN CO LTD·Filed 2018·Granted Sep 29, 2020·0 cites·6 claims
- 2047US10220340B2Laminated nonwoven fabric and air purifierPANASONIC IP MAN CO LTD·Filed 2015·Granted Mar 5, 2019·0 cites·11 claims
- 2147US2010327044A1Method for manufacturing electronic component modulePANASONIC CORP·Filed 2009·Application pending·0 cites
- 2247US2017151748A1Laminated nonwoven fabricPANASONIC IP MAN CO LTD·Filed 2016·Application pending·0 cites
- 2346US10195556B2Laminated nonwoven fabric and air purifierPANASONIC IP MAN CO LTD·Filed 2016·Granted Feb 5, 2019·0 cites·10 claims
- 2445US7841081B2Method for manufacturing electronic parts modulePANASONIC CORP·Filed 2009·Granted Nov 30, 2010·0 cites·4 claims
- 2544US2015096651A1Auxiliary joining agent and method for producing the samePANASONIC IP MAN CO LTD·Filed 2013·Application pending·0 cites
- 2643US9902880B2Film material, electronic component using film material, and method for producing electronic componentPANASONIC IP MAN CO LTD·Filed 2016·Granted Feb 27, 2018·0 cites·13 claims
- 2742US8817487B2Electronic component mounting system and electronic component mounting methodMOTOMURA KOJI·Filed 2010·Granted Aug 26, 2014·0 cites·4 claims
- 2839US2016199765A1Nonwoven fabric, air purifier using the same, and method for producing nonwoven fabricPANASONIC IP MAN CO LTD·Filed 2015·Application pending·0 cites
- 2933US2012309133A1Electronic component mounting methodWADA YOSHIYUKI·Filed 2011·Application pending·0 cites
- 3033US2014231492A1Electronic component mounting method, electronic component placement machine, and electronic component mounting systemSAEKI TSUBASA·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →