Inventor · disambiguated record
Len-Yi Leu
Also filed as: LEU LEN-YI
17 granted patents·1 pending application·128 citations·filing 1998–2019
92Inventor score
Top patents by PatentIndex Score
18 records- 0183US9540231B2MEMS device with a bonding layer embedded in the capTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jan 10, 2017·4 cites·20 claims
- 0282US10343895B2Micro-electro-mechanical system (MEMS) structure including isolation ring at sidewalls of semiconductor via and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 9, 2019·2 cites·20 claims
- 0379US9926190B2MEMS devices and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Mar 27, 2018·3 cites·20 claims
- 0479US6365459B1Method for making flash memory cell having reentrant angle floating gateWINBOND ELECTRONICS CORP·Filed 2000·Granted Apr 2, 2002·23 cites·10 claims
- 0577US10150664B2Microelectromechanical systems (MEMS) stopper structure for stiction improvementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Dec 11, 2018·3 cites·20 claims
- 0674US10112822B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Oct 30, 2018·1 cites·20 claims
- 0773US6114723AFlash memory cell using poly to poly tunneling for eraseWINDBOND ELECTRONIC CORP·Filed 1998·Granted Sep 5, 2000·32 cites·11 claims
- 0872US6489200B1Capacitor fabrication process for analog flash memory devicesWINBOND ELECTRONICS CORP·Filed 2000·Granted Dec 3, 2002·16 cites·18 claims
- 0964US10865100B2Method for forming micro-electro-mechanical system (MEMS) structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 15, 2020·0 cites·20 claims
- 1064US6174771B1Split gate flash memory cell with self-aligned processWINBOND ELECTRONICS CORP·Filed 1998·Granted Jan 16, 2001·22 cites·8 claims
- 1161US6395590B1Capacitor plate formation in a mixed analog-nonvolatile memory deviceWINBOND ELECTRONICS CORP·Filed 2000·Granted May 28, 2002·10 cites·9 claims
- 1256US10266400B2MEMS device with multi pressureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 23, 2019·0 cites·20 claims
- 1355US9764948B2MEMS cap with multi pressureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Sep 19, 2017·0 cites·20 claims
- 1450US10981779B2MEMS devices and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 20, 2021·0 cites·20 claims
- 1547US9868630B2Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 16, 2018·0 cites·20 claims
- 1644US6015984ACapacitor with oxide/nitride/oxide composite dielectric suitable for embedded nonvolatile memory in analog applicationsWINBOND ELECTRONICS CORP·Filed 1998·Granted Jan 18, 2000·12 cites·6 claims
- 1733US6924527B2Split gate flash memory cell structure and method of manufacturing the sameWINBOND ELECTRONICS CORP·Filed 2003·Granted Aug 2, 2005·0 cites·18 claims
- 1832US2003047766A1Split gate flash memory cell structure and method of manufacturing the sameWINBOND ELECTRONICS CORP·Filed 2001·Application pending·0 cites
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