Inventor · disambiguated record
Thomas R. Miller
Also filed as: MILLER THOMAS · MILLER THOMAS R · MILLER THOMAS RICHARD
46 granted patents·1 pending application·1,014 citations·filing 1992–2009
98Inventor score
Files withIBM37ENDICOTT INTERCONNECT TECH INC3KONINKL PHILIPS ELECTRONICS NV3ROCHE DIAGNOSTICS OPERATIONS2NATURAL FUELS CORP1
Top patents by PatentIndex Score
47 records- 0197US6608757B1Method for making a printed wiring boardIBM·Filed 2002·Granted Aug 19, 2003·120 cites·12 claims
- 0294US6268016B1Manufacturing computer systems with fine line circuitized substratesIBM·Filed 1996·Granted Jul 31, 2001·89 cites·21 claims
- 0392US6479093B2Composite laminate circuit structure and methods of interconnecting the sameIBM·Filed 2002·Granted Nov 12, 2002·50 cites·17 claims
- 0491US6630743B2Copper plated PTH barrels and methods for fabricatingIBM·Filed 2001·Granted Oct 7, 2003·53 cites·11 claims
- 0589US6388204B1Composite laminate circuit structure and methods of interconnecting the sameIBM·Filed 2000·Granted May 14, 2002·75 cites·12 claims
- 0685US6815126B2Printed wiring board with conformally plated circuit tracesIBM·Filed 2002·Granted Nov 9, 2004·30 cites·7 claims
- 0784US6291779B1Fine pitch circuitization with filled plated through holesIBM·Filed 1999·Granted Sep 18, 2001·52 cites·17 claims
- 0883US7547577B2Method of making circuitized substrate with solder paste connectionsENDICOTT INTERCONNECT TECH INC·Filed 2006·Granted Jun 16, 2009·13 cites·18 claims
- 0981US5299249AHeat transfer techniques for moving thermal energy from high power X-ray tubes on rotating CT gantries to a remote locationPICKER INT INC·Filed 1992·Granted Mar 29, 1994·53 cites·27 claims
- 1079US6467160B1Fine pitch circuitization with unfilled plated through holesIBM·Filed 2000·Granted Oct 22, 2002·25 cites·13 claims
- 1179US6445769B1Internal bearing cooling using forced airKONINKL PHILIPS ELECTRONICS NV·Filed 2000·Granted Sep 3, 2002·16 cites·26 claims
- 1278US7919060B2Dispenser for flattened articlesROCHE DIAGNOSTICS OPERATIONS·Filed 2009·Granted Apr 5, 2011·11 cites·23 claims
- 1377US6570102B2Structure for high speed printed wiring boards with multiple differential impedance-controlled layerIBM·Filed 2001·Granted May 27, 2003·26 cites·20 claims
- 1476US7582262B2Dispenser for flattened articlesROCHE DIAGNOSTICS OPERATIONS·Filed 2004·Granted Sep 1, 2009·33 cites·58 claims
- 1576US6618940B2Fine pitch circuitization with filled plated through holesIBM·Filed 2001·Granted Sep 16, 2003·19 cites·13 claims
- 1675US6453010B1X-ray tube liquid flux directorKONINKL PHILIPS ELECTRONICS NV·Filed 2000·Granted Sep 17, 2002·12 cites·23 claims
- 1773US6603834B1X-ray tube anode cold plateKONINKL PHILIPS ELECTRONICS NV·Filed 2001·Granted Aug 5, 2003·12 cites·18 claims
- 1871US6852152B2Colloidal seed formulation for printed circuit board metallizationIBM·Filed 2002·Granted Feb 8, 2005·12 cites·14 claims
- 1971US6593534B2Printed wiring board structure with z-axis interconnectionsIBM·Filed 2001·Granted Jul 15, 2003·17 cites·45 claims
- 2070US6436803B2Manufacturing computer systems with fine line circuitized substratesIBM·Filed 2001·Granted Aug 20, 2002·11 cites·33 claims
- 2169US6188027B1Protection of a plated through hole from chemical attackIBM·Filed 1999·Granted Feb 13, 2001·22 cites·19 claims
- 2266US6225028B1Method of making an enhanced organic chip carrier packageIBM·Filed 2000·Granted May 1, 2001·12 cites·34 claims
- 2365US6221694B1Method of making a circuitized substrate with an apertureIBM·Filed 1999·Granted Apr 24, 2001·31 cites·13 claims
- 2464USD342525SFuel dispenserNATURAL FUELS CORP·Filed 1992·Granted Dec 21, 1993·17 cites·1 claims
- 2562US6905589B2Circuitized substrate and method of making sameENDICOTT INTERCONNECT TECH INC·Filed 2003·Granted Jun 14, 2005·12 cites·26 claims
- 2661US6469256B1Structure for high speed printed wiring boards with multiple differential impedance-controlled layersIBM·Filed 2000·Granted Oct 22, 2002·10 cites·6 claims
- 2761US6265075B1Circuitized semiconductor structure and method for producing suchIBM·Filed 1999·Granted Jul 24, 2001·24 cites·29 claims
- 2860US7615477B2Method of fabricating a BGA package having decreased adhesionIBM·Filed 2006·Granted Nov 10, 2009·1 cites·4 claims
- 2960US6790305B2Method and structure for small pitch z-axis electrical interconnectionsIBM·Filed 2002·Granted Sep 14, 2004·8 cites·9 claims
- 3060US6447914B1Method of uniformly depositing seed and a conductor and the resultant printed circuit structureIBM·Filed 2000·Granted Sep 10, 2002·3 cites·15 claims
- 3160US5953594AMethod of making a circuitized substrate for chip carrier structureIBM·Filed 1997·Granted Sep 14, 1999·27 cites·21 claims
- 3259US7712210B2Method of providing a printed circuit board with an edge connection portionENDICOTT INTERCONNECT TECH INC·Filed 2007·Granted May 11, 2010·2 cites·16 claims
- 3359US7148566B2Method and structure for an organic package with improved BGA lifeIBM·Filed 2001·Granted Dec 12, 2006·7 cites·8 claims
- 3459US6537608B2Protection of a plated through hole from chemical attackIBM·Filed 2001·Granted Mar 25, 2003·13 cites·17 claims
- 3558US5997997AMethod for reducing seed deposition in electroless platingIBM·Filed 1997·Granted Dec 7, 1999·15 cites·18 claims
- 3655US6955849B2Method and structure for small pitch z-axis electrical interconnectionsIBM·Filed 2004·Granted Oct 18, 2005·5 cites·9 claims
- 3753US7083901B2Joining member for Z-interconnect in electronic devices without conductive pasteIBM·Filed 2002·Granted Aug 1, 2006·4 cites·28 claims
- 3851US6136513AMethod of uniformly depositing seed and a conductor and the resultant printed circuit structureIBM·Filed 1998·Granted Oct 24, 2000·12 cites·21 claims
- 3949US6207354B1Method of making an organic chip carrier packageIBM·Filed 1999·Granted Mar 27, 2001·16 cites·14 claims
- 4049US6063481AProcess for removal of undersirable conductive material on a circuitized substrate and resultant circuitized substrateIBM·Filed 1998·Granted May 16, 2000·12 cites·9 claims
- 4149US5935652AMethod for reducing seed deposition in electroless platingIBM·Filed 1998·Granted Aug 10, 1999·11 cites·22 claims
- 4247US6740819B2Printed wiring boardIBM·Filed 2003·Granted May 25, 2004·1 cites·8 claims
- 4347US6110650AMethod of making a circuitized substrateIBM·Filed 1998·Granted Aug 29, 2000·12 cites·34 claims
- 4444US7378227B2Method of making a printed wiring board with conformally plated circuit tracesIBM·Filed 2004·Granted May 27, 2008·0 cites·18 claims
- 4542US6845557B2Method for producing an electronic package possessing controlled impedance characteristicsIBM·Filed 2002·Granted Jan 25, 2005·1 cites·5 claims
- 4640US6544584B1Process for removal of undesirable conductive material on a circuitized substrate and resultant circuitized substrateIBM·Filed 1997·Granted Apr 8, 2003·7 cites·13 claims
- 4740US2003209799A1Copper plated PTH barrels and methods for fabricatingIBM·Filed 2003·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Thomas R. Miller files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →