Inventor · disambiguated record
Ya-Wen Yeh
Also filed as: YEH YA-WEN
18 granted patents·3 pending applications·22 citations·filing 2017–2025
91Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD21
Top patents by PatentIndex Score
21 records- 0193US11791161B2Pattern fidelity enhancementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 17, 2023·2 cites·20 claims
- 0292US10861698B2Pattern fidelity enhancementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 8, 2020·5 cites·19 claims
- 0391US11094556B2Method of manufacturing semiconductor devices using directional processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 17, 2021·4 cites·20 claims
- 0489US11289332B2Directional processing to remove a layer or a material formed over a substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 29, 2022·4 cites·20 claims
- 0589US10354874B2Directional processing to remove a layer or a material formed over a substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jul 16, 2019·4 cites·20 claims
- 0687US2025308892A1Pattern fidelity enhancementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0785US12334342B2Pattern fidelity enhancementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jun 17, 2025·0 cites·20 claims
- 0884US12230507B2Method of manufacturing semiconductor devices using directional processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 18, 2025·0 cites·20 claims
- 0983US10707081B2Fine line patterning methodsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 7, 2020·2 cites·18 claims
- 1080US12153350B2Method of manufacturing semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Nov 26, 2024·0 cites·20 claims
- 1180US2025044708A1Method of manufacturing semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1279US11955338B2Directional deposition for semiconductor fabricationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 9, 2024·0 cites·20 claims
- 1377US11651972B2Method of manufacturing semiconductor devices using directional processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 16, 2023·0 cites·20 claims
- 1476US11796922B2Method of manufacturing semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 24, 2023·1 cites·10 claims
- 1576US2025149343A1Method of manufacturing semiconductor devices using directional processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1675US11862465B2Fine line patterning methodsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jan 2, 2024·0 cites·20 claims
- 1774US11569090B2Directional deposition for semiconductor fabricationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 31, 2023·0 cites·20 claims
- 1870US11239078B2Fine line patterning methodsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 1, 2022·0 cites·18 claims
- 1966US11881401B2Method of forming metal featuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 23, 2024·0 cites·20 claims
- 2061US11075079B2Directional deposition for semiconductor fabricationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 27, 2021·0 cites·20 claims
- 2161US11043381B2Directional patterning methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 22, 2021·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →