Inventor · disambiguated record
John P. Timler
Also filed as: TIMLER JOHN · TIMLER JOHN P · TIMLER JOHN PHILIP
8 granted patents·5 pending applications·8 citations·filing 2012–2023
76Inventor score
Files withSCIENCE APPL INT CORP9INDIANA INTEGRATED CIRCUITS LLC1SCIENCE APPLICAIONS INT CORPORATION1TIMLER JOHN P1US GOVT AS REPRESENTED BY SECY OF AIR FORCE1
Top patents by PatentIndex Score
13 records- 0191US10619059B1Catalyst ink for three-dimensional conductive constructsSCIENCE APPL INT CORP·Filed 2019·Granted Apr 14, 2020·7 cites·18 claims
- 0282US11860040B2Infrared transparent constructs and methods of making themSCIENCE APPL INT CORP·Filed 2021·Granted Jan 2, 2024·1 cites·20 claims
- 0377US11658450B2Wavelength flexibility through variable-period poling of a compact cylindrical optical fiber assemblyUS GOVT AS REPRESENTED BY SECY OF AIR FORCE·Filed 2022·Granted May 23, 2023·0 cites·14 claims
- 0472US2024159592A1Infrared Transparent Constructs and Methods of Making ThemSCIENCE APPLICAIONS INT CORPORATION·Filed 2023·Application pending·0 cites
- 0568US11892379B2Thermal and/or optical signature simulating systems and methods of making and using such systemsSCIENCE APPL INT CORP·Filed 2021·Granted Feb 6, 2024·0 cites·20 claims
- 0667US10883005B1Catalyst ink for three-dimensional conductive constructsSCIENCE APPL INT CORP·Filed 2020·Granted Jan 5, 2021·0 cites·11 claims
- 0761US2013063863A1Insulator Based Upon One or More Dielectric StructuresTIMLER JOHN P·Filed 2012·Application pending·0 cites
- 0859US12152156B2Self-sintering conductive inksSCIENCE APPL INT CORP·Filed 2021·Granted Nov 26, 2024·0 cites·6 claims
- 0959US2023151492A1Direct Printing of Catalyst InksSCIENCE APPL INT CORP·Filed 2021·Application pending·0 cites
- 1058US11631565B2Thermal fuseSCIENCE APPL INT CORP·Filed 2020·Granted Apr 18, 2023·0 cites·16 claims
- 1158US2023055916A1Self-sintered thermal interface materialsSCIENCE APPL INT CORP·Filed 2022·Application pending·0 cites
- 1247US2023047730A1Sinterable Compounds Comprising Dielectric Material, Articles Formed from Such Compounds, and Methods of Forming Such Compounds and ArticlesSCIENCE APPL INT CORP·Filed 2021·Application pending·0 cites
- 1339US11224126B2Edge interconnects for use with circuit boards and integrated circuitsINDIANA INTEGRATED CIRCUITS LLC·Filed 2020·Granted Jan 11, 2022·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →