Inventor · disambiguated record
Michiaki Hiyoshi
Also filed as: HIYOSHI MICHIAKI
26 granted patents·1 pending application·472 citations·filing 1990–2018
97Inventor score
Top patents by PatentIndex Score
27 records- 0194US8519561B2Power module and vehicle-mounted inverter using the sameAZUMA KATSUNORI·Filed 2010·Granted Aug 27, 2013·27 cites·3 claims
- 0294US8472188B2Semiconductor power module, inverter, and method of manufacturing a power moduleHORIUCHI KEISUKE·Filed 2010·Granted Jun 25, 2013·28 cites·7 claims
- 0391US8564953B2Semiconductor power module, inverter/converter including the same, and method of manufacturing a cooling jacket for semiconductor power moduleHORIUCHI KEISUKE·Filed 2011·Granted Oct 22, 2013·16 cites·14 claims
- 0491US6297549B1Hermetically sealed semiconductor power module and large scale module comprising the sameTOSHIBA KK·Filed 1999·Granted Oct 2, 2001·100 cites·12 claims
- 0586US9000601B2Power semiconductor moduleAZUMA KATSUNORI·Filed 2012·Granted Apr 7, 2015·10 cites·4 claims
- 0676US10685901B2Boiling cooling deviceHYUNDAI MOTOR CO LTD·Filed 2018·Granted Jun 16, 2020·2 cites·8 claims
- 0776US5866944AMultichip press-contact type semiconductor deviceTOSHIBA KK·Filed 1996·Granted Feb 2, 1999·51 cites·60 claims
- 0875US6967402B2Hermetically sealed semiconductor power module and large scale module comprising the sameTOSHIBA KK·Filed 2004·Granted Nov 22, 2005·16 cites·5 claims
- 0971US5610439APress-contact type semiconductor devicesTOSHIBA KK·Filed 1995·Granted Mar 11, 1997·46 cites·21 claims
- 1069US6756667B2Hermetically sealed semiconductor power module and large scale module comprising the sameTOSHIBA KK·Filed 2001·Granted Jun 29, 2004·12 cites·10 claims
- 1168US5708299AMultichip press-contact type semiconductor deviceTOSHIBA KK·Filed 1996·Granted Jan 13, 1998·40 cites·37 claims
- 1265US9076774B2Semiconductor device and a method of manufacturing sameHITACHI POWER SEMICONDUCTOR DEVICE LTD·Filed 2013·Granted Jul 7, 2015·1 cites·4 claims
- 1365US6770964B2Semiconductor device including intermediate wiring elementTOSHIBA KK·Filed 2001·Granted Aug 3, 2004·12 cites·16 claims
- 1460US6765239B2Semiconductor device having junction-termination structure of resurf typeTOSHIBA KK·Filed 2002·Granted Jul 20, 2004·9 cites·24 claims
- 1557USD598846SPortion of power module for power inverterHITACHI LTD·Filed 2009·Granted Aug 25, 2009·10 cites·1 claims
- 1657US5990501AMultichip press-contact type semiconductor deviceTOSHIBA KK·Filed 1997·Granted Nov 23, 1999·24 cites·18 claims
- 1751US6967357B1Voltage-driven power semiconductor deviceTOSHIBA KK·Filed 2000·Granted Nov 22, 2005·6 cites·10 claims
- 1850US10541188B2Power module and manufacturing method thereofHYUNDAI MOTOR CO LTD·Filed 2017·Granted Jan 21, 2020·0 cites·4 claims
- 1950US8723320B2Power module and manufacturing method thereofYOSHIDA ISAMU·Filed 2012·Granted May 13, 2014·1 cites·6 claims
- 2049US5835985AReverse conducting gate-turnoff thyristorTOSHIBA KK·Filed 1994·Granted Nov 10, 1998·14 cites·1 claims
- 2141US5360985APress-contact type semiconductor deviceTOSHIBA KK·Filed 1993·Granted Nov 1, 1994·11 cites·14 claims
- 2239US6147368AVoltage-driven power semiconductor deviceTOSHIBA KK·Filed 1998·Granted Nov 14, 2000·9 cites·25 claims
- 2339US5760425AInternal compression bonded semiconductor device with a chip frame enabling a longer creepage distanceTOKYO SHIBAURA ELECTRIC CO·Filed 1997·Granted Jun 2, 1998·8 cites·20 claims
- 2436US2004021149A1Pressure-contact type semiconductor deviceTOSHIBA KK·Filed 2003·Application pending·0 cites
- 2535US5874750APressure-contact type semiconductor deviceTOSHIBA KK·Filed 1996·Granted Feb 23, 1999·5 cites·16 claims
- 2635US5140406ACrimp-type semiconductor device having non-alloy structureTOSHIBA KK·Filed 1990·Granted Aug 18, 1992·7 cites·13 claims
- 2734US5198882ACrimp-type power semiconductor deviceTOSHIBA KK·Filed 1990·Granted Mar 30, 1993·7 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →