Inventor · disambiguated record
Chouhei Okuno
Also filed as: OKUNO CHOUHEI
3 granted patents·5 pending applications·7 citations·filing 2008–2012
58Inventor score
Top patents by PatentIndex Score
8 records- 0177US9159598B2Semiconductor wafer mounting method and semiconductor wafer mounting apparatusYAMAMOTO MASAYUKI·Filed 2012·Granted Oct 13, 2015·5 cites·4 claims
- 0261US7922857B2Label joining method and label joining apparatusNITTO DENKO CORP·Filed 2008·Granted Apr 12, 2011·2 cites·4 claims
- 0339US2010038009A1Method and apparatus for joining protective tape to semiconductor waferOKUNO CHOUHEI·Filed 2009·Application pending·0 cites
- 0434US2011236171A1Workpiece transport method and workpiece transport deviceYAMAMOTO MASAYUKI·Filed 2011·Application pending·0 cites
- 0534US2011232820A1Adhesive tape joining method and adhesive tape joining apparatusYAMAMOTO MASAYUKI·Filed 2011·Application pending·0 cites
- 0633US2011017391A1Adhesive tape joining method and adhesive tape joining apparatusYAMAMOTO MASAYUKI·Filed 2010·Application pending·0 cites
- 0733US2011120641A1Adhesive tape joining apparatus and adhesive tape joining methodYAMAMOTO MASAYUKI·Filed 2010·Application pending·0 cites
- 0831US8679289B2Method and apparatus for separating protective tapeOKUNO CHOUHEI·Filed 2011·Granted Mar 25, 2014·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →