Inventor · disambiguated record
Eiki Oosawa
Also filed as: OOSAWA EIKI
5 granted patents·1 pending application·18 citations·filing 2006–2014
73Inventor score
Top patents by PatentIndex Score
6 records- 0181US8881967B2Apparatus for interconnecting connection pads of a head-gimbal assembly and manufacturing method for the head-gimbal assemblyMATSUMOTO YUHSUKE·Filed 2009·Granted Nov 11, 2014·8 cites·11 claims
- 0280US8477457B2Head-gimbal assembly with a suspension-lead pad having a form that is configured to inhibit formation of an inter-pad solder bridgeMATSUMOTO YUHSUKE·Filed 2011·Granted Jul 2, 2013·7 cites·22 claims
- 0369US10029327B2Solder ball jet nozzle having improved reliabilityHGST Netherlands BV·Filed 2014·Granted Jul 24, 2018·1 cites·18 claims
- 0466US8245749B2Method and apparatus for manufacturing a head-gimbal assemblyIMAI HIDETO·Filed 2009·Granted Aug 21, 2012·2 cites·4 claims
- 0539US2011132879A1Connecting electrical partsMATSUMOTO YUHSUKE·Filed 2010·Application pending·0 cites
- 0634US8503132B2Head gimbal assembly, slider, and method of manufactuing a head gimbal assembly with reduced lead lengthOOSAWA EIKI·Filed 2006·Granted Aug 6, 2013·0 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →